SLLSE96F September   2011  – October 2015 TPD12S016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4  Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Conforms to HDMI Compliance Tests Without any External Components
      2. 7.3.2  IEC 61000-4-2 ESD Protection
      3. 7.3.3  Supports HDMI 1.4 Data Rate
      4. 7.3.4  Matches Class D and Class C Pin Mapping
      5. 7.3.5  8-Channel ESD Lines for Four Differential Pairs with Ultra-low Differential Capacitance Matching (0.05 pF)
      6. 7.3.6  On-Chip Load Switch With 55-mA Current Limit Feature at the HDMI 5V_OUT Pin
      7. 7.3.7  Auto-direction Sensing I2C Level Shifter With One-Shot Circuit to Drive a Long HDMI Cable (750-pF Load)
      8. 7.3.8  Back-Drive Protection on HDMI Connector Side Ports
      9. 7.3.9  Integrated Pullup and Pulldown Resistors per HDMI Specification
      10. 7.3.10 Space Saving 24-Pin RKT Package and 24-TSSOP Package
      11. 7.3.11 DDC/CEC LEVEL SHIFT Circuit Operation
      12. 7.3.12 DDC/CEC Level Shifter Operational Notes For VCCA = 1.8 V
      13. 7.3.13 Rise-Time Accelerators
      14. 7.3.14 Noise Considerations
      15. 7.3.15 Resistor Pullup Value Selection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Example 1: HDMI Controller Using One Control Line
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Example 2: HDMI Controller Using CT_HPD and LS_OE
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 TPD12S016RKT
      2. 10.2.2 TPD12S016PW
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RKT|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (December 2014) to F Revision

  • Added test condition frequency to capacitance Go
  • Added test condition frequency to capacitance Go
  • Added Community Resources Go

Changes from D Revision (August 2013) to E Revision

  • Added Handling Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go

Changes from * Revision (January 2013) to A Revision

  • Added Eye Diagram Using EVM Without TPD12S016 for the TMDS Lines at 1080p, 340MHz Pixel Clock, 3.4GbpsGo
  • Added Eye Diagram Using EVM with TPD12S016 for the TMDS Lines at 1080p, 340MHz Pixel Clock, 3.4GbpsGo

Changes from A Revision (February 2013) to B Revision

  • Added PW and RKT packages values for IO capacitanceGo
  • Added LOAD SWITCH ILEAKAGE_REVERSE vs V5V_OUT graph.Go
  • Updated Circuit Schematic Diagram.Go

Changes from B Revision (February 2013) to C Revision

  • Updated table formatting.Go

Changes from C Revision (August 2013) to D Revision

  • Updated power savings options table.Go