SLVS640F October   2007  – February 2015 TPD12S520

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ±8-kV Contact ESD Protection on External Lines
      2. 7.3.2 Single-Chip ESD Solution for HDMI Driver
      3. 7.3.3 Supports All HDMI 1.3 and HDMI 1.4b Data Rates
      4. 7.3.4 38-Pin TSSOP Provides Seamless Layout Option With HDMI Connector
      5. 7.3.5 24-Pin WQFNPackage for Space Constrained Applications
      6. 7.3.6 Integrated Level Shifting for the Control Lines
      7. 7.3.7 Backdrive Protection
      8. 7.3.8 Lead-Free Package
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (September 2014) to F Revision

  • Added clarification to HDMI data rates.Go
  • Added clarification to HDMI data rates.Go

Changes from D Revision (December 2013) to E Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from C Revision (April 2009) to D Revision

  • Added new application to Applications section. Go
  • Added RMN Package to Datasheet. Go
  • Updated RMN Package. Go
  • Updated Pin Description Table. Go
  • Added additonal graphs to Typical Performance section. Go