SLVSDN7B August   2016  – February 2022 TPD1E10B06-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2.     ESD Ratings - AEC Specification
    3. 6.2 ESD Ratings—IEC Specification
    4. 6.3 ESD Ratings—ISO Specification
    5. 6.4 Recommended Operating Conditions
    6. 6.5 Thermal Information
    7. 6.6 Electrical Characteristics
    8. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  AEC-Q101 Qualified
      2. 7.3.2  IEC 61000-4-2 ESD Protection
      3. 7.3.3  ISO 10605 ESD Protection
      4. 7.3.4  IEC 61000-4-5 Surge Protection
      5. 7.3.5  IO Capacitance
      6. 7.3.6  Dynamic Resistance
      7. 7.3.7  DC Breakdown Voltage
      8. 7.3.8  Ultra Low Leakage Current
      9. 7.3.9  Clamping Voltage
      10. 7.3.10 Industrial Temperature Range
      11. 7.3.11 Space-Saving Footprint
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision A (August 2016) to Revision B (February 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Features section to include the DPY (X1SON) and DYA (SOD-523) package featuresGo
  • Updated the Description sectionGo
  • Added the DYA package details to the Device Information tableGo
  • Removed the TPD1E10B06 device from the Device Information tableGo
  • Added the DYA package to the Pin Configuration and Functions sectionGo
  • Updated the Overview sectionGo
  • Updated the Functional Block Diagram Go
  • Updated the Feature Description sectionGo
  • Updated the ISO 10605 ESD Protection sectionGo
  • Updated the Typical Application Schematic figureGo
  • Updated the Related Documentation sectionGo

Changes from Revision * (August 2016) to Revision A (August 2016)

  • Changed device status from Product Preview to Production Data Go