SLLSEH9B October   2013  – July 2016 TPD1S414

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (EN, ACK Pins)
    6. 6.6  Electrical Characteristics (OVP Circuit)
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics (nFET)
    9. 6.9  Supply Current Consumption
    10. 6.10 Thermal Shutdown Feature
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overvoltage Protection on VBUS_CON up to 30-V DC
      2. 7.3.2 Low RON nFET Switch Supports Host and Charging Mode
      3. 7.3.3 ±15-kV IEC 61000-4-2 Level 4 ESD Protection
      4. 7.3.4 100-V IEC 61000-4-5 µs Surge Protection
      5. 7.3.5 Start-Up and OVP Recovery Delay
      6. 7.3.6 Integrated Input Enable and Status Output Signal
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 VBUS_CON < VUVLO
      2. 7.4.2 VUVLO < VBUS_CON < VOVP
      3. 7.4.3 VBUS_CON > VOVP
      4. 7.4.4 OVP Operation
      5. 7.4.5 Host/OTG Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 USB VBUS Voltage Range
        2. 8.2.2.2 USB VBUS Operating Current
        3. 8.2.2.3 VBUS_CON and VBUS_SYS Capacitance
        4. 8.2.2.4 IEC 61000-4-5 100-V Open-Circuit Surge
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resource
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YZ|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.