SLVSDL1 April   2017 TPD2S300

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 2-Channels of Short-to-VBUS Overvoltage Protection (CC1, CC2 Pins): 24-VDC Tolerant
      2. 7.3.2 2-Channels of IEC61000-4-2 ESD Protection (CC1, CC2 Pins)
      3. 7.3.3 Low Quiescent Current: 3.23 µA (Typical), VPWR, VM = 3.3 V
      4. 7.3.4 CC1, CC2 Overvoltage Protection FETs 200 mA Capable for Passing VCONN Power
      5. 7.3.5 CC Dead Battery Resistors Integrated for Handling Dead Battery Use Case in Mobile Devices
      6. 7.3.6 1.4-mm × 1.4-mm WCSP Package
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Smart-Phone Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 VBIAS Capacitor Selection
          2. 8.2.1.2.2 Dead Battery Operation
          3. 8.2.1.2.3 CC Line Capacitance
          4. 8.2.1.2.4 FLT Pin Operation
          5. 8.2.1.2.5 VCONN Operation
          6. 8.2.1.2.6 Low Quiescent Current
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Laptop Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 VBIAS Capacitor Selection
          2. 8.2.2.2.2 Dead Battery Operation
          3. 8.2.2.2.3 CC Line Capacitance
          4. 8.2.2.2.4 FLT Pin Operation
          5. 8.2.2.2.5 VCONN Operation
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Power Adaptor Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 VBIAS Capacitor Selection
          2. 8.2.3.2.2 Dead Battery Operation
          3. 8.2.3.2.3 CC Line Capacitance
          4. 8.2.3.2.4 FLT Pin Operation
          5. 8.2.3.2.5 VCONN Operation
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

TPD2S300YFF Evaluation Module

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.