SLVSCG4C
January 2016 – August 2020
TPD3S714-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings—AEC Specification
6.3
ESD Ratings—IEC Specification
6.4
ESD Ratings—ISO Specification
6.5
Recommended Operating Conditions
6.6
Thermal Information
6.7
Electrical Characteristics
6.8
Timing Requirements
6.9
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
AEC-Q100 Qualified
8.3.2
Short-to-Battery and Short-to-Ground Protection on VBUS_CON
8.3.3
Short-to-Battery and Short-to-VBUS Protection on VD+, VD–
8.3.4
ESD Protection on VBUS_CON, VD+, VD–
8.3.5
Low RON nFET VBUS Switch
8.3.6
High Speed Data Switches
8.3.7
Hiccup Current Limit
8.3.8
Fast Overvoltage Response Time
8.3.9
Integrated Input Enable
8.3.10
Fault Output Signal
8.3.11
Thermal Shutdown Feature
8.3.12
16-pin SSOP Package
8.4
Device Functional Modes
8.4.1
Normal Operation
8.4.2
Overvoltage Condition
8.4.3
Overcurrent Condition
8.4.4
Short-Circuit Condition
8.4.5
Device Logic Tables
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Short-to-Battery Tolerance
9.2.2.2
Maximum Current on VBUS
9.2.2.3
USB Data Rate
9.2.3
Application Curves
10
Power Supply Recommendations
10.1
VBUS Path
10.2
VIN Pin
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DBQ|16
MSOI004H
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvscg4c_oa
slvscg4c_pm
12.1
Documentation Support