SLVSDH9D March   2016  – August 2020 TPD3S716-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—AEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 ESD Ratings—ISO Specification
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Timing Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  AEC-Q100 Qualified
      2. 8.3.2  Short-to-Battery and Short-to-Ground Protection on VBUS_CON
      3. 8.3.3  Short-to-Battery and Short-to-VBUS Protection on VD+, VD–
      4. 8.3.4  ESD Protection on VBUS_CON, VD+, VD–
      5. 8.3.5  Low RON nFET VBUS Switch
      6. 8.3.6  High Speed Data Switches
      7. 8.3.7  Adjustable Hiccup Current Limit up to 2.4-A
      8. 8.3.8  Fast Over-Voltage Response Time
      9. 8.3.9  Independent VBUS and Data Enable Pins for Configuring both Host and Client/OTG Mode
      10. 8.3.10 Fault Output Signal
      11. 8.3.11 Thermal Shutdown Feature
      12. 8.3.12 16-Pin SSOP Package
      13. 8.3.13 Reverse Current Detection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Overvoltage Condition
      3. 8.4.3 Overcurrent Condition
      4. 8.4.4 Short-Circuit Condition
      5. 8.4.5 Device Logic Table
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Short-to-Battery Tolerance
        2. 9.2.2.2 Maximum Current on VBUS
        3. 9.2.2.3 Power Dissipation and Junction Temperature
        4. 9.2.2.4 USB Data Rate
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 VBUS Path
    2. 10.2 VIN Pin
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Layout Optimized for Thermal Performance
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.7 Adjustable Hiccup Current Limit up to 2.4-A

The VBUS path of this device has an integrated overcurrent protection circuit. The current limit threshold for the overcurrent protection is adjustable via an external resistor RADJ to GND on the IADJ pin. Equation 1 to Equation 3 approximate the minimum, nominal, and maximum current limit values for TPD3S716-Q1 assuming a 1% tolerant resistor:

Equation 1. ILIM(TYP) = 143 × RADJ(–0.983)
Equation 2. ILIM(MIN) = 129 × RADJ(–0.981) – 0.02
Equation 3. ILIM(MAX) = 141.5 × RADJ(–0.962) + 0.015

where

  • ILIM(TYP) is the nominal current limit value in (A)
  • ILIM(MIN) is the minimum current limit value in (A)
  • ILIM(MAX) is the maximum current limit value in (A)
  • RADJ is the nominal resistor to GND on the IADJ pin in (Ω)
GUID-A08CEF39-6E63-4F7E-9857-5185326944BD-low.gifFigure 8-1 TPD3S716-Q1 Current Limit Thresholds vs. RADJ

Equation 1, Equation 2 and Equation 3 are useful for approximating the current limit threshold of TPD3S716-Q1; however, they do not constitute as part of TI's published device specifications for purposes of TI's product warranty. For the officially tested current limit threshold values, see the Electrical Characteristics table.

When the VBUS current exceeds the overcurrent threshold, the device goes into a fault state where it limits the current to the overcurrent threshold value and asserts the FLT pin. After a short blanking time, the device cycles on and off to try to check if the connected device is still in overcurrent.