SLLS682O July   2006  – July 2019 TPD4E001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from N Revision (March 2018) to O Revision

  • Added TPD4E001R DBV Package image and updated Pin Funtions tableGo

Changes from M Revision (May 2017) to N Revision

  • TPD4E001DBVR Device Marking changed from NFY to NFYF Go

Changes from L Revision (May 2016) to M Revision

Changes from K Revision (January 2015) to L Revision

  • Added frequency test condition to Channel input capacitance in the Electrical Characteristics tableGo
  • Added Community ResourcesGo

Changes from J Revision (December 2013) to K Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from I Revision (September 2012) to J Revision

  • Updated Description.Go
  • Removed Ordering Information table.Go

Changes from H Revision (August 2012) to I Revision

  • Added DCK2 package to Pin Out drawings.Go
  • Updated Electrical Characteristics tableGo

Changes from G Revision (December 2011) to H Revision

  • Updated TOP-SIDE MARKING column in ORDERING INFORMATION table.Go

Changes from F Revision (May 2011) to G Revision

  • Updated document formatting.Go
  • Added DPK (PUSON) package and package information.Go

Changes from E Revision (April 2011) to F Revision

  • Added Peak Pulse Waveform Graph to Typical Operating Characteristics.Go

Changes from C Revision (April 2007) to D Revision

  • Added DBV (SOT-23) package and package information.Go