SLLS682O July   2006  – July 2019 TPD4E001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1) TPD4E001 UNIT
DRL (SOT) DBV (SOT) DCK (SC70) DPK (USON) DRS (SON)
6 PINS 6 PINS 6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 226.4 259.7 251.1 247.6 91.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.3 186.5 88.1 124.8 106.9 °C/W
RθJB Junction-to-board thermal resistance 61.2 107.6 54.8 204.2 64.8 °C/W
ψJT Junction-to-top characterization parameter 6.7 71.4 1.7 19.2 10.2 °C/W
ψJB Junction-to-board characterization parameter 61 107.1 54.1 209.3 64.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A 29.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.