SLVSBQ8E
December 2012 – October 2024
TPD4E1B06
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Ultra Low Leakage Current 0.5 nA (Maximum)
6.3.2
Transient Protection for 4 I/O Lines
6.3.3
I/O Capacitance 0.7 pF (Typical)
6.3.4
Bi-Directional (ESD) Protection Diode Array
6.3.5
Low ESD Clamping Voltage
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
Signal Range on IO1, IO2, IO3, and IO4 Pins
7.2.2.2
Operating Frequency
7.2.3
Application Curves
7.3
Layout
7.3.1
Layout Guidelines
7.3.2
Layout Examples
8
Device and Documentation Support
8.1
Receiving Notification of Documentation Updates
8.2
Support Resources
8.3
Trademarks
8.4
Electrostatic Discharge Caution
8.5
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCK|6
MPDS114E
DRL|6
MPDS159H
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsbq8e_oa
slvsbq8e_pm
5.6
Typical Characteristics
Figure 5-1
DC Voltage Sweep I-V Curve
Figure 5-3
TLP Plot IO to GND
Figure 5-5
+8 kV IEC Waveform
Figure 5-7
Insertion Loss
Figure 5-2
Surge Curve (tp = 8/20 μs), Pin IO to GND
Figure 5-4
Leakage vs Temperature
Figure 5-6
–8 kV IEC Waveform
Figure 5-8
Capacitance vs V
BIAS