SLVSA55B November   2009  – November 2016 TPD4S1394

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VIO IO voltage at D+, D–, VCLMP 0 4 V
FWPWR_EN Switch output –0.5 4.6 V
TA Operating free-air temperature –40 85 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except 5, 6, 7, and 8 ±2500 V
Pins 5, 6, 7, and 8 ±15000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) All pins except 5, 6, 7, and 8 ±1000
Pins 5, 6, 7, and 8 ±1000
IEC 61000-4-2 contact discharge Pins 5, 6, 7, and 8 (interface side) ±6000
IEC 61000-4-2 air-gap discharge Pins 5, 6, 7, and 8 (interface side) ±6000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
VCC Supply voltage 3 3.6 V

6.4 Thermal Information

THERMAL METRIC(1) TPD4S1394 UNIT
DQL (X2SON)
8 PINS
RθJA Junction-to-ambient thermal resistance 167.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 56.8 °C/W
RθJB Junction-to-board thermal resistance 82.3 °C/W
ψJT Junction-to-top characterization parameter 1.5 °C/W
ψJB Junction-to-board characterization parameter 82 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDX FWPWR_EN trip voltage
(D+ and D– pins)		 High-to-low 2.9 3.4 4 V
Low-to-high 2.7 3.2 3.8
VCLMP Value on pin No connection 2.45 V
VBR Breakdown voltage at VCLAMP II = 1 mA 4.2 V
VD Diode forward voltage for lower clamp ID = 8 mA lower clamp diode –0.6 –0.8 –0.95 V
FWPWR_EN Switch output VCC V
RDYN Dynamic resistance (in and out clamp) of D+, D– I = 1 A 1 Ω
CIO I/O capacitance of D+, D– VIO = 2.5 V 1.5 2 pF
ICC Current consumption VCC = 3.3 V, FWPWR_EN = high 130 200 µA
(1) A 0.1-µF decoupling capacitor is required at VCC.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tTRIP Delay time for FWPWR_EN to go low Loading on FWPWR_EN = 50 pF 0.5 2 5 µs
tRESET Delay time for FWPWR_EN to go high after trip FWPWR_EN = VCC 300 450 600 ms

6.7 Typical Characteristics

TPD4S1394 g_iocap_volt_lvsa55.gif
D+, D– Pins
Figure 1. I/O Capacitance vs I/O Voltage
TPD4S1394 g_insertloss_lvsa55.gif
D+, D– Pins
Figure 2. Insertion Loss (S21)