SLVSBR1F January   2013  – January 2015 TPD4S214

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Thermal Shutdown
    6. 7.6  Electrical Characteristics for EN, FLT, DET, D+, D-, VBUS, ID Pins
    7. 7.7  Electrical characteristics for UVLO / OVLO
    8. 7.8  Electrical Characteristics for DET Circuits
    9. 7.9  Electrical Characteristics for OTG Switch
    10. 7.10 Electrical Characteristics for Current Limit and Short Circuit Protection
    11. 7.11 Supply Current Consumption
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Protection at VBUS from -7 V to 30 V
      2. 8.3.2  IEC 61000-4-2 Level 4 ESD Protection
      3. 8.3.3  Low RDS(ON) N-CH FET Switch for High Efficiency
      4. 8.3.4  Compliant with USB2.0 and USB3.0 OTG spec
      5. 8.3.5  User Adjustable Current Limit From 250 mA to Beyond 1.2 A
      6. 8.3.6  Built-in Soft-start
      7. 8.3.7  Reverse Current Blocking
      8. 8.3.8  Over Voltage Lock Out for VBUS
      9. 8.3.9  Under Voltage Lock Out for VOTG_IN
      10. 8.3.10 Thermal Shutdown and Short Circuit Protection
      11. 8.3.11 Auto Retry on any Fault; no Latching off States
      12. 8.3.12 Integrated VBUS Detection Circuit
      13. 8.3.13 Low Capacitance TVS ESD Clamp for USB2.0 High Speed Data Rate
      14. 8.3.14 Internal 16ms Startup Delay
      15. 8.3.15 Space Saving WCSP (12-YFF) Package
      16. 8.3.16 Inrush Current Protection
      17. 8.3.17 Input Capacitor (Optional)
      18. 8.3.18 Output Capacitor (Optional)
      19. 8.3.19 Current Limit
      20. 8.3.20 Thermal Shutdown
      21. 8.3.21 VBUS Detection
      22. 8.3.22 Test Configuration
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 USB 2.0 Without Using On-chip VBUS Detect
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 USB 2.0 Using On-chip VBUS Detect
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 USB 3.0 Without Using On-chip VBUS Detect
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Tstg Storage temperature range –40 85 °C
VOTG_IN, ADJ, EN Input voltage –0.5 7 V
VBUS Output voltage to USB connector –7 30 V
FLT, DET Output voltage –0.5 7 V
Input clamp current VI < 0 –50 mA
IOUT Continuous current through FLT and DET output 10 mA
IGND Continuous current through GND 100 mA
TJ(max) maximum junction temperature –65 150 °C
D+, D-, ID, VBUS pins IEC 61000-4-2 Contact Discharge at 25°C ±15 kV
D+, D-, ID, VBUS pins IEC 61000-4-2 Air-gap Discharge at 25°C ±15 kV
D+, D-, ID pins Peak Pulse Current (tp = 8/20 μs) at 25°C 7.8 A
D+, D-, ID pins Peak Pulse Power (tp = 8/20 μs) at 25°C 84 W
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
IEC 61000-4-2 Contact Discharge D+, D-, ID, VBUS Pins ±15000 V
IEC 61000-4-2 Air-gap Discharge
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as 500 V may actually have higher performance.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
TA Operating free-air temperature -40 85 °C
VIH High-level input voltage EN 1.2 V
VIL Low-level input voltage EN 0.4 V
tEN EN ramp rate for proper turn on Valid ramp rate is between 10 µs and 100 ms, rising and falling 0.01 100 ms
tUVLO_SLEW VOTG_IN ramp rate for proper UVLO operation Valid ramp rate is between 10 µs and 100 ms, rising and falling 0.01 100 ms
tOVLO_SLEW VBUS ramp rate for proper OVLO operation Valid ramp rate is between 10 µs and 100 ms, rising and falling 0.01 100 ms
TA_VBUS_ATT Time to detect VBUS device attachment and turn on DET 200 ms

7.4 Thermal Information

THERMAL METRIC(1) TPD4S214 UNIT
YFF
12 PINS
RθJA Junction-to-ambient thermal resistance 89.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.5
RθJB Junction-to-board thermal resistance 40.0
ψJT Junction-to-top characterization parameter 3.0
ψJB Junction-to-board characterization parameter 39.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Thermal Shutdown

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP MAX UNIT
TSHDN+ Shutdown temp rising 141 ºC
TSHDN– Shutdown temp falling 125 ºC
THYST Thermal-shutdown Hysteresis 16 ºC
PMAX Maximum power dissipation VOTG_IN = 5 V, Rload = 5 Ω, EN = 5 V, RADJ = 75 KΩ 0.16 W
TJMAX Junction Temp at max power dissipation 150 ºC

7.6 Electrical Characteristics for EN, FLT, DET, D+, D–, VBUS, ID Pins

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IIL_EN EN pin input leakage current EN = 3.3 V 1 µA
IOL FLT, DET pin output leakage current FLT, DET = 3.6 V 1 µA
VOL_FLT Low-level output voltage FLT VBUS or VOTG_IN = 5 V or 0 V IOL = 100 µA 100 mV
VOL_DET Low-level output voltage DET VBUS and VOTG_IN = 5 V or 0 V IOL = 100 µA 100 mV
CEN Enable capacitance VBIAS = 1.8 V, f = 1 MHz, 30 mVpp ripple, VOTG_IN = 5 V 4.5 pF
VD Diode forward voltage D+, D–, ID pins; lower clamp diode IO = 8 mA 0.95 V
IL_D Leakage current on D+, D–, ID Pins D+, D–, ID = 3.3 V 100 nA
ΔCIO Differential capacitance between the D+, D– lines VBIAS = 1.8 V, f = 1 MHz, 30 mVpp ripple, VOTG_IN = 5 V 0.04 pF
CIO Capacitance to GND for the D+, D– lines VBIAS = 1.8 V, f = 1 MHz, 30 mVpp ripple, VOTG_IN = 5 V 1.9 pF
Capacitance to GND for the ID lines 1.9
VBR Breakdown voltage D+, D–, ID pins Ibr = 1 mA 6 V
Breakdown voltage on VBUS Ibr = 1 mA 33 V
RDYN Dynamic on resistance D+, D–, ID clamps 1 Ω

7.7 Electrical characteristics for UVLO / OVLO

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT UNDER-VOLTAGE LOCKOUT
VUVLO+ Under-voltage lock-out, input power detected threshold rising VOTG_IN increasing from 0 V to 5 V, No load on VBUS pin 3.4 3.6 3.8 V
VUVLO– Under-voltage lock-out, input power detected threshold falling VOTG_IN decreasing from 5 V to 0 V, No load on VBUS pin 3.0 3.2 3.5 V
VHYS-UVLO Hysteresis on UVLO Δ of VUVLO+ and VUVLO– 260 mV
TRUVLO Recovery time from UVLO VOTG_IN increasing from 0V to 5V, No load on VBUS pin;
time from VOTG_IN = VUVLO+ to FLT toggles high		 18 ms
TRESP_UVLO Response time for UVLO VOTG_IN decreasing from 5V to 0V, No load on VBUS pin;
time from VOTG_IN = VUVLO– to FLT toggles low		 0.18 µs
OUTPUT OVERVOLTAGE LOCKOUT
VOVP+ OVLO rising threshold Both VOTG_IN and VBUS increasing from 5 V to 7 V 5.55 6.15 6.45 V
VOVP– OVLO falling threshold Both VOTG_IN and VBUS decreasing from 7 V to 5 V 5.4 6 6.3 V
VHYS-OVP Hysteresis on OVLO Δ of VUVLO+ and VUVLO– 100 mV
TROVLO Recovery time from OVLO Both VOTG_IN and VBUS decreasing from 7 V to 5 V, VOTG_IN = 5 V;
time from VBUS = VOVP– to FLT toggles high		 9 ms
TRESP_OVLO Response time for OVLO Both VOTG_IN and VBUS increasing from 5 V to 7 V, VOTG_IN = 5 V;
time from VBUS = VOVP+ to FLT toggles low		 17 µs

7.8 Electrical Characteristics for DET Circuits

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VBUS_VALID– Valid VBUS voltage detect VBUS = 7 V to 0 V 2.7 2.9 3 V
VBUS_VALID+ Valid VBUS voltage detect VBUS = 0 V to 7 V 5.3 5.4 5.6 V
TDET_DELAY– VBUS detect propagation delay– VBUS 0 V to 4 V, 200 ns ramp; VBUS = VBUS_VALID– MIN to DET toggles high 4.9 µs
TDET_DELAY+ VBUS detect propagation delay+ VBUS 6 V to 4 V, 200 ns ramp; VBUS = VBUS_VALID+ MAX to DET toggles low 1.8 µs

7.9 Electrical Characteristics for OTG Switch

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RDS_ON OTG switch resistance TA = 25 °C, VBUS = 5 V, IOUT = 100 mA, RADJ = 75 kΩ(1) 263 290 mΩ
VDROP OTG switch voltage drop VBUS = 5 V, IOUT = 100 mA, RADJ = 75 kΩ 12.6 29 mV
IOTG_OFF_30V Leakage current at 30V Measured at VOTG_IN VBUS = 30 V, EN = 5 V, VOTG_IN = 5 V 6 µA
VBUS = 30 V, EN = 5 V, VOTG_IN = 0 V 11 nA
IOTG_OFF_2V Leakage current at–2V VBUS = -2 V, EN = 5 V, VOTG_IN = 5 V 30 µA
IOTG_OFF Standby Leakage current VBUS = 0 V, EN = 0 V, VOTG_IN = 5 V 32 µA
VBUS = 5 V, EN = 0 V, VOTG_IN = 0 V 10 nA
IBUS_REV Reverse Leakage current VBUS = 5 V, EN = 5 V, VOTG_IN = 0V 1 nA
VBUS = 5.5 V, EN = 5 V, VOTG_IN = 5 V 6 µA
TON Turn-ON time RL = 100 Ω, CL = 1 µF, RADJ = 75 kΩ 16 ms
TOFF_EN Turn-OFF time RL = 100 Ω, CL = 1 µF, RADJ = 75 kΩ, toggle EN 80 µs
TOFF_OTG Turn-OFF time RL = 100 Ω, CL = 1 µF, RADJ = 75 kΩ, toggle VOTG_IN 0.5 µs
TRISE Output rise time RL = 100 Ω, CL = 1 µF, RADJ = 75 kΩ 137 µs
TFALL Output fall time RL = 100 Ω, CL = 1 µF, RADJ = 75 kΩ 1.6 µs
(1) RDS(ON) is measured at 25°C

7.10 Electrical Characteristics for Current Limit and Short Circuit Protection

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IOCP Current−limit threshold (maximum DC output current IOUT delivered to load) VOTG_IN = 5 V, RLOAD = 2.0 Ω RADJ = 226 kΩ(1) 235 245 281 mA
RADJ = 75 kΩ(1) 735 792 830
RADJ = 62 kΩ(1) 885 959 1005
RADJ = 45 kΩ(1) 1128 1200 1363
TBLANK Blanking time after enable VOTG_IN = 5 V RL = 1 Ω, CL = 1 µF,
RADJ = 75 kΩ		 4 ms
TDEGL Deglitch time while enabled VOTG_IN = 5 V, RL = 100 Ω,
CL = 1 µF, RADJ = 75 kΩ,
apply short to ground		 9.4 ms
TDET_SC Response time to short circuit 10 µs
TREG Short circuit regulation time Hiccup pulse width; auto-retry time 13 ms
TOCP Short circuit over current protection time Hiccup pulse period 153 ms
VSHORT Short circuit threshold 4 V
IINRUSH Inrush current during a startup SeeFigure 23 under test configuration RL = 100 Ω, CL = 22 µF, RADJ = 75 kΩ 726 mA
(1) External resistor tolerance is ±1%

7.11 Supply Current Consumption

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP MAX UNIT
IVOTG_INON High-level VOTG_IN operating current consumption VOTG_IN = 5 V, No load on VBUS,
EN = 5 V		 RADJ = 75 kΩ 162 200 µA
RADJ = 226 kΩ 150 200 µA

7.12 Typical Characteristics

C001_SLVSBR1.png
Figure 1. IOCP vs. RADJ
C003_SLVSBR1.png
Figure 3. Inrush, RADJ = 75 kΩ
C005_SLVSBR1.png
Figure 5. 10 Ω Load to Short, 20 µs
C007_SLVSBR1.png
Figure 7. 10 Ω Load to Short, 100 ms
C009_SLVSBR1.png
Figure 9. +8 kV Contact, 1 GHz
C011_SLVSBR1.png
Figure 11. CIO vs. VBIAS, f = 1 MHz
C013_SLVSBR1.png
Figure 13. TPD4S214 Turn Off Characteristics
C015_SLVSBR1.png
Figure 15. OVLO
C017_SLVSBR1.png
Figure 17. VBUS Valid Detect Lower
C002_SLVSBR1.png
Figure 2. RDSON vs. Temperature
C004_SLVSBR1.png
Figure 4. 10 Ω Load to Short, 2 µs
C006_SLVSBR1.png
Figure 6. 10 Ω Load to Short, 5 ms
C008_SLVSBR1.png
Figure 8. Data Line Insertion Loss
C010_SLVSBR1.png
Figure 10. -8 kV Contact, 1 GHz
C012_SLVSBR1.png
Figure 12. TPD4S214 Turn On Characteristics
C014_SLVSBR1.png
Figure 14. UVLO
C016_SLVSBR1.png
i.
Figure 16. VBUS Valid Detect Upper