The TPD5E003 is a five-channel electrostatic discharge (ESD) transient voltage suppression (TVS) device. This device offers ±15-kV IEC contact and ±15-kV air-gap (level 4) ESD protection, and features five identical ESD clamping diodes that can be used to protect either five unidirectional (0 V to 5 V) I/O lines or four bidirectional (–5 V to 5 V) I/O lines. The compact DPF package is an industry standard and is convenient for component placement in
space-constrained applications. Typical application interfaces include SIM card interfaces, audio lines (mics, earphones, and speakerphones), SD interfaces, and keypads, or other buttons. Typical end equipment includes cell phones, tablets, remote controllers, and wearables.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPD5E003 | X2SON (6) | 1.00 mm × 1.00 mm |
Changes from A Revision (January 2013) to B Revision
Changes from * Revision (December 2012) to A Revision
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
I/O | 1 | I/O | ESD Protected channel |
3 | |||
4 | |||
5 | |||
6 | |||
GND | 2 | — | Ground |
MIN | MAX | UNIT | |
---|---|---|---|
I/O voltage tolerance | 5.5 | V | |
Peak pulse current (tp = 8/20 μs), IPP | 3 | A | |
Peak pulse power (tp = 8/20 μs), PPP | 40 | W | |
Storage temperature, Tstg | –55 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±4000 | V |
Charged device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | IEC 61000-4-2 contact discharge | ±15000 | V |
IEC 61000-4-2 air-gap discharge | ±15000 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
Operating free-air temperature, TA | –40 | 125 | °C | ||
Operating voltage | Pin 1, 3, 4, 5, 6 to Pin 2 | 0 | 5 | V |
THERMAL METRIC(1) | TPD5E003 | UNIT | |
---|---|---|---|
DPF (X2SON) | |||
6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 246.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 87.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 187.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 198 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 32 | °C/W |
PARAMETER | TEST CONDITION | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
VRWM | Reverse stand-off voltage | II = 0.1 µA | 5 | V | ||
ILEAK | Leakage Current | Pin 1, 3, 4, 5, or 6 = 5 V, Pin 2 = 0 V | 10 | 100 | nA | |
VCLAMP | Clamp voltage with ESD strike | IPP = 6 A, TLP, Dx pin to GND, TA = 25 °C | 13 | 15.6 | V | |
IPP = 10 A, TLP, Dx pin to GND, TA = 25 °C | 16.3 | 19.5 | V | |||
RDYN | Dynamic resistance | ITLP = 6 A to 10 A, Dx pin to GND, TA = 25 °C | 0.8 | 1 | Ω | |
ITLP = 6 A to 10 A, GND to Dx pin, TA = 25 °C | 0.3 | 0.4 | Ω | |||
CIO | IO capacitance | VIO = 2.5 V, 1 MHz, TA = 25 °C | 5.6 | 7 | 8.4 | pF |
VIO = 0 V, 1 MHz, TA = 25 °C | 8 | 10 | 12 | pF | ||
VBR | Break-down voltage | IIO = 1 mA | 6 | 7 | 8.5 | V |
The TPD5E003 is a five-channel ESD protection device. Each channel has ±15 kV contact and ±15 kV air-gap IEC ESD performance. When TPD5E003 is used in the unidirectional clamping configuration, it stays inactive from 0 V to 5 V and has low leakage. When the voltages on the I/O lines exceed the breakdown voltage, it starts to clamp and thus, keep the I/O line voltages low. Same mechanism applies to the bidirectional configuration where one of the channels is used as the ground pin and the other four are connected to I/O. The low leakage inactive range in bidirectional configuration is from –5 V to 5 V. The compact DPF package helps save board area. Typical application interfaces include SIM card interfaces, audio lines (mics, earphones, and speakerphones), SD interfaces, and keypads, or other buttons. Typical end equipment includes cell phones, tablets, remote controllers, and wearables.
TPD5E003 is a robust ESD protection device. Each of the five channels has ±15 kV contact and ±15 kV air-gap IEC ESD performance. This and the low dynamic resistance ensure the circuits protected by it only see a low residual transient pulse during the ESD. A typical I/O capacitance of 7 pF makes sure that this device is suitable to be used in a wide frequency range of the applications. The capacitance is even smaller when used in the bidirectional configuration, thus can be used for even higher frequencies. Low leakage current can keep the unnecessary power dissipation low during the normal operation. The industrial temperature range of –40°C to 125°C makes this device suitable for a wide applications range including consumer electronics, industrial and automotive. With the robust design, TPD5E003 is able to take 3 A of 8/20 µs surge current (40 W). The small package saves the board area and the pinout makes it easy to route.
Each channel of TPD5E003 is a passive clamp that has low leakage during normal operation when the voltage between I/O pin and GND is below VRWM and activates when it goes above VBR. During IEC ESD events (contact and air-gap), transient voltages as high as ±15 kV can be clamped. When the voltages on the protected lines fall below the trigger voltage, the device reverts back to the low leakage passive state.
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
When a system contains a human interface, it becomes vulnerable to large system-level ESD strikes that standard ICs cannot survive. TVS ESD protection diodes are typically used to suppress ESD at these interfaces. The TPD5E003 is a five-channel unidirectional TVS device, which is typically used to provide paths to ground for dissipating ESD events on signal or power lines between a human interface connector and a system. As the current from ESD passes through the device, only a small voltage drop is present across the diode structure. This is the voltage presented to the protected IC. The low RDYN of the triggered TVS holds this voltage, VCLAMP, to a tolerable level to the protected IC.
The TPD5E003 offers five identical unidirectional ESD protection channels. The device can also be used as four identical bidirectional ESD protection channels. To do so, pin 5 would be connected to ground, with pin 1, 3, 4, and 6 connected to the I/O to be protected. In the bidirectional configuration, I/O capacitance is reduced by half and dynamic resistance increases.
For this design example, the TPD5E003 will be used to protect the SIM card in the bidirectional configuration.
For this application, the system parameters in Table 1 are known.
DESIGN PARAMETER | VALUE |
---|---|
SIM card power supply voltage (Vcc) | 3.3 V or 5 V |
Signal pins voltage range | 0 V to Vcc |
Signal pins data rate | 1 Mbps to 20 Mbps |
Required IEC 61000-4-2 ESD Protection | ±8-kV Contact or ±15-kV Air-Gap |
To begin the design process, some parameters must be decided upon; the designer should make sure:
For this application, the power supply and signal voltage range is 0 to 3.3 V or to 5 V. When used in bidirectional configuration, at ±5 V the channel has very low leakage current; therefore, the bidirectional TVS will not break down during normal operation, and therefore normal operation of the power supply and signal pins will not be affected.
Next, consider the data rate of the signal. The SIM card clock frequency that the signals run off is from 1 MHz to 20 MHz; ensure that the TVS I/O capacitance will not distort this signal by filtering it with the inherent capacitance. Either a unidirectional or bidirectional ESD clamping device is good for this application, but bidirectional configuration has a smaller capacitance and thus each channel has sufficient bandwidth to pass the signal without distorting it, thus this configuration is used here.
Finally, the human interface in this application requires the Level 4 IEC 61000-4-2 system-level ESD protection (±8-kV Contact or ±15-kV Air-Gap). The TPD5E003 can survive at least ±15-kV Contact or ±15-kV Air-Gap. Therefore, the device can provide sufficient ESD protection for the interface. For any TVS diode to provide its full range of ESD protection capabilities, as well as to minimize the noise and EMI disturbances the board will see during ESD events, it is crucial that a system designer uses proper board layout of their TVS ESD protection diodes. See Layout Example for instructions on properly laying out TPD5E003.
This device is a passive TVS diode-based ESD protection device, so there is no need to power it. Ensure that the maximum voltage specifications for each pin are not violated.