SLLS799C february   2008  – july 2023 TPD6E004

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-506F33E9-2D36-4FA4-A00D-A85E2C505B35/SLLS7994401
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings – Surge Protection
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-EC17841B-4E88-4854-A22A-E9202169C094-low.gif Figure 5-1 RSE Package, 8-Pin UQFN (Bottom View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
IO1 1 I/O ESD-protected channel
IO2 2 I/O ESD-protected channel
IO3 3 I/O ESD-protected channel
GND 4 GND Ground
IO4 5 I/O ESD-protected channel
IO5 6 I/O ESD-protected channel
IO6 7 I/O ESD-protected channel
VCC 8 PWR Power-supply input. Bypass VCC to GND with a 0.1-μF ceramic capacitor.
(1) I = input, O = output, GND = ground, PWR = power