SLVSEL9 June   2018 TPD8S300A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     CC and SBU Over-Voltage Protection
    2.     CC and DP/DM Over-Voltage Protection
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings—JEDEC Specification
    3. 7.3 ESD Ratings—IEC Specification
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 4-Channels of Short-to-VBUS Overvoltage Protection (CC1, CC2, SBU1, SBU2 Pins or CC1, CC2, DP, DM Pins): 24-VDC Tolerant
      2. 8.3.2 8-Channels of IEC 61000-4-2 ESD Protection (CC1, CC2, SBU1, SBU2, DP_T, DM_T, DP_B, DM_B Pins)
      3. 8.3.3 CC1, CC2 Overvoltage Protection FETs 600 mA Capable for Passing VCONN Power
      4. 8.3.4 CC Dead Battery Resistors Integrated for Handling the Dead Battery Use Case in Mobile Devices
      5. 8.3.5 Advantages over TPD8S300
        1. 8.3.5.1 Improved Dead Battery Performance
        2. 8.3.5.2 USB Type-C Port Stays Connected during an IEC 61000-4-2 ESD Strike
      6. 8.3.6 3-mm × 3-mm WQFN Package
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VBIAS Capacitor Selection
        2. 9.2.2.2 Dead Battery Operation
        3. 9.2.2.3 CC Line Capacitance
        4. 9.2.2.4 Additional ESD Protection on CC and SBU Lines
        5. 9.2.2.5 FLT Pin Operation
        6. 9.2.2.6 How to Connect Unused Pins
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

RUK Package
20-Pin WQFN
Top View
TPD8S300A TPD8S300_Pin_Out_4.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NO. NAME
1 C_SBU1 I/O Connector side of the SBU1 OVP FET. Connect to either SBU pin of the USB Type-C connector. Alternatively, connect to either USB2.0 pin of the USB Type-C connector to protect the USB2.0 pins instead of the SBU pins
2 C_SBU2 I/O Connector side of the SBU2 OVP FET. Connect to either SBU pin of the USB Type-C connector. Alternatively, connect to either USB2.0 pin of the USB Type-C connector to protect the USB2.0 pins instead of the SBU pins
3 VBIAS Power Pin for ESD support capacitor. Place a 0.1-µF capacitor on this pin to ground
4 C_CC1 I/O Connector side of the CC1 OVP FET. Connect to either CC pin of the USB Type-C connector
5 C_CC2 I/O Connector side of the CC2 OVP FET. Connect to either CC pin of the USB Type-C connector
6 RPD_G2 I/O Short to C_CC2 if dead battery resistors are needed. If dead battery resistors are not needed, short pin to GND
7 RPD_G1 I/O Short to C_CC1 if dead battery resistors are needed. If dead battery resistors are not needed, short pin to GND
8 GND GND Ground
9 FLT O Open drain for fault reporting
10 VPWR Power 2.7-V to 3.6-V power supply
11 CC2 I/O System side of the CC2 OVP FET. Connect to either CC pin of the CC/PD controller
12 CC1 I/O System side of the CC1 OVP FET. Connect to either CC pin of the CC/PD controller
13 GND GND Ground
14 SBU2 I/O System side of the SBU2 OVP FET. Connect to either SBU pin of the SBU MUX. Alternatively, connect to either USB2.0 pin of the USB2.0 Phy when protecting the USB2.0 pins instead of protecting the SBU pins
15 SBU1 I/O System side of the SBU1 OVP FET. Connect to either SBU pin of the SBU MUX. Alternatively, connect to either USB2.0 pin of the USB2.0 Phy when protecting the USB2.0 pins instead of protecting the SBU pins
16 D4 I/O USB2.0 IEC ESD protection. Connect to any of the USB2.0 pins of the USB Type-C connector
17 D3 I/O USB2.0 IEC ESD protection. Connect to any of the USB2.0 pins of the USB Type-C connector
18 GND GND Ground
19 D2 I/O USB2.0 IEC ESD protection. Connect to any of the USB2.0 pins of the USB Type-C connector
20 D1 I/O USB2.0 IEC ESD protection. Connect to any of the USB2.0 pins of the USB Type-C connector
— Thermal Pad GND Internally connected to GND. Used as a heatsink. Connect to the PCB GND plane
(1) I = input, O = output, I/O = input and output, GND = ground, P = power