SLIS117C August   2007  – May 2022 TPIC1021A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Test Circuit
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Local Interconnect Network (LIN) Bus
        1. 10.3.1.1 Transmitter Characteristics
        2. 10.3.1.2 Receiver Characteristics
      2. 10.3.2 Transmit Input (TXD)
        1. 10.3.2.1 TXD Dominant State Time-Out
      3. 10.3.3 Receive Output (RXD)
        1. 10.3.3.1 RXD Wake-up Request
      4. 10.3.4 Supply Voltage (VSUP)
      5. 10.3.5 Ground (GND)
      6. 10.3.6 Enable Input (EN)
      7. 10.3.7 NWake Input (NWake)
      8. 10.3.8 Inhibit Output (INH)
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating States
        1. 10.4.1.1 Normal Mode
        2. 10.4.1.2 Sleep Mode
          1. 10.4.1.2.1 Wake-Up Events
        3. 10.4.1.3 Standby Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VSUP (2)Supply line supply voltage(3)040V
VNWakeNWake dc and transient input voltage (through 33-kΩ serial resistor)–0.340V
VINHINH voltage–0.3VSUP + 0.3V
Logic pin input voltage (RXD, TXD, EN)–0.35.5V
VLINLIN dc-input voltage–4040V
INWakeNWake current(4)–3.6mA
Thermal shutdown200°C
Thermal shutdown hysteresis25°C
TJJunction temperature–40150°C
TstgStorage temperature–40165°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) The device is specified for operation in the range of VSUP from 7 V to 27 V. Operating the device above 27 V may significantly raise the junction temperature of the device and system level thermal design requires consideration.
(4) If due to ground shifts, VNWake ≤ VGND – 0.3 V, thus the current into NWake must be limited through a serial resistance.