SLIS117C August   2007  – May 2022 TPIC1021A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Test Circuit
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Local Interconnect Network (LIN) Bus
        1. 10.3.1.1 Transmitter Characteristics
        2. 10.3.1.2 Receiver Characteristics
      2. 10.3.2 Transmit Input (TXD)
        1. 10.3.2.1 TXD Dominant State Time-Out
      3. 10.3.3 Receive Output (RXD)
        1. 10.3.3.1 RXD Wake-up Request
      4. 10.3.4 Supply Voltage (VSUP)
      5. 10.3.5 Ground (GND)
      6. 10.3.6 Enable Input (EN)
      7. 10.3.7 NWake Input (NWake)
      8. 10.3.8 Inhibit Output (INH)
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating States
        1. 10.4.1.1 Normal Mode
        2. 10.4.1.2 Sleep Mode
          1. 10.4.1.2.1 Wake-Up Events
        3. 10.4.1.3 Standby Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Thermal Information

THERMAL METRIC(1)TPIC1021UNIT
D (SOIC)
8 PINS
RθJAJunction-to-ambient thermal resistance145°C/W
RθJC(top)Junction-to-case (top) thermal resistance61.9°C/W
RθJBJunction-to-board thermal resistance55.5°C/W
ψJTJunction-to-top characterization parameter14.3°C/W
ψJBJunction-to-board characterization parameter55°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.