SLIS125B December   2006  – December 2014 TPIC74100-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Dissipation Rating Table
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Switch-Mode Input/Output Pins (L1, L2)
      2. 7.3.2  Supply Pin (Vdriver)
      3. 7.3.3  Internal Supply Decoupling Pin (Vlogic)
      4. 7.3.4  Input Voltage Monitoring Pin (AIN)
      5. 7.3.5  Input Undervoltage Alarm Pin (AOUT)
      6. 7.3.6  Reset Delay Timer Pin (REST)
      7. 7.3.7  Reset Pin (RESET)
      8. 7.3.8  Main Regulator Output Pin (VOUT)
      9. 7.3.9  Low-Power-Mode Pin (CLP)
      10. 7.3.10 Switch-Output Pin (5Vg)
      11. 7.3.11 5Vg-Enable Pin (5Vg_ENABLE)
      12. 7.3.12 Slew-Rate Control Pins (SCR0, SCR1)
      13. 7.3.13 Modulator Frequency Setting (Pin Rmod)
      14. 7.3.14 Ground Pin (PGND)
      15. 7.3.15 Enable Pin (ENABLE)
      16. 7.3.16 Bootstrap Pins (Cboot1 and Cboot2)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Clock Modulator
      2. 7.4.2 Buck/Boost Transitioning
      3. 7.4.3 Buck SMPS
      4. 7.4.4 Boost SMPS
      5. 7.4.5 Extension of the Input Voltage Range on V(driver)
      6. 7.4.6 Low-Power Mode
      7. 7.4.7 Temperature and Short-Circuit Protection
      8. 7.4.8 Switch-Output Pin (5Vg) Current Limitation
      9. 7.4.9 Soft Start
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Buck Mode
        2. 8.2.2.2 Boost Mode
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Switch-Mode Power Supply
        1. 10.1.1.1 Inductor
        2. 10.1.1.2 Filter Capacitors
        3. 10.1.1.3 Traces and Ground Plane
      2. 10.1.2 Package and PCB Land Configuration for a Multilayer PCB
      3. 10.1.3 Multilayer (Side View)
      4. 10.1.4 Single-Layer
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

p0021-02.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
SCR1 1 I Programmable slew-rate control
Cboot2 2 I External bootstrap capacitor
Cboot1 3 I External bootstrap capacitor
Vdriver 4 I Input voltage source
L1 5 I Inductor input (an external Schottky diode(1) to GND must be connected to L1)
PGND 6 I Power ground
L2 7 I Inductor output
VOUT 8 O 5-V regulated output
5Vg 9 O Switched 5-V supply
AIN 10 I Programmable alarm setting
CLP 11 I/O Low-power operation mode (digital input)
RESET 12 O Reset function (open drain)
AOUT 13 O Alarm output (open drain)
REST 14 O Programmable reset timer delay
Rmod 15 I Main switching frequency modulation setting to minimize EMI
GND 16 I Ground
Vlogic 17 O Supply decoupling output (may be used as a 5-V supply for logic-level inputs)
ENABLE 18 I Switch-mode regulator enable/disable
5Vg_ENABLE 19 I Switched 5-V voltage regulator output enable/disable
SCR0 20 I Programmable slew-rate control
Exposed thermal pad of the package should be connected to GND or left floating.
(1) Maximum 0.4 V at 1 A and 125°C