SLIS140A October   2011  – December 2014 TPIC74101-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Dissipation Rating
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Switch-Mode Input/Output Pins (L1, L2)
      2. 7.3.2  Supply Pin (Vdriver)
      3. 7.3.3  Internal Supply Decoupling Pin (Vlogic)
      4. 7.3.4  Input Voltage Monitoring Pin (AIN)
      5. 7.3.5  Input Undervoltage Alarm Pin (AOUT)
      6. 7.3.6  Reset Delay Timer Pin (REST)
      7. 7.3.7  Reset Pin (RESET)
      8. 7.3.8  Main Regulator Output Pin (VOUT)
      9. 7.3.9  Low-Power-Mode Pin (CLP)
      10. 7.3.10 Switch-Output Pin (5Vg)
      11. 7.3.11 5Vg-Enable Pin (5Vg_ENABLE)
      12. 7.3.12 Slew-Rate Control Pins (SCR0, SCR1)
      13. 7.3.13 Modulator Frequency Setting (Pin Rmod)
      14. 7.3.14 Ground Pin (PGND)
      15. 7.3.15 Enable Pin (ENABLE)
      16. 7.3.16 Bootstrap Pins (Cboot1 and Cboot2)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Clock Modulator
      2. 7.4.2 Buck/Boost Transitioning
      3. 7.4.3 Buck SMPS
      4. 7.4.4 Boost SMPS
      5. 7.4.5 Extension of the Input Voltage Range on V(driver)
      6. 7.4.6 Low-Power Mode
      7. 7.4.7 Temperature and Short-Circuit Protection
      8. 7.4.8 Switch Output Pin (5Vg) Current Limitation
      9. 7.4.9 Soft Start
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Buck Mode
        2. 8.2.2.2 Boost Mode
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Switch-Mode Power Supply
        1. 10.1.1.1 Inductor
        2. 10.1.1.2 Filter Capacitors
        3. 10.1.1.3 Traces and Ground Plane
      2. 10.1.2 Package and PCB Land Configuration for a Multilayer PCB
      3. 10.1.3 Multilayer (Side View)
      4. 10.1.4 Single-Layer
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.