SLIS110C April   2003  – March 2015 TPIC8101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Functional Terminal Description
        1. 8.3.1.1  Supply Voltage (VDD)
        2. 8.3.1.2  Ground (GND)
        3. 8.3.1.3  Reference Supply (Vref)
        4. 8.3.1.4  Buffered Integrator Output (OUT)
        5. 8.3.1.5  Integration/Hold Mode Selection (INT/HOLD)
        6. 8.3.1.6  Chip Select for SPI (CS)
        7. 8.3.1.7  Oscillator Input (XIN)
        8. 8.3.1.8  Oscillator Output (XOUT)
        9. 8.3.1.9  Data Output (SDO)
        10. 8.3.1.10 Data Input (SDI)
        11. 8.3.1.11 Serial Clock (SCLK)
        12. 8.3.1.12 Test (TEST)
        13. 8.3.1.13 Feedback Output for Amplifiers (CH1FB and CH2FB)
        14. 8.3.1.14 Input Amplifiers (CH1P, CH1N, CH2P, and CH2N)
      2. 8.3.2 Timing Information
    4. 8.4 Device Functional Modes
      1. 8.4.1 System Transfer Equation
      2. 8.4.2 Programming in Normal Mode (TEST = 1)
      3. 8.4.3 Default SPI Mode
      4. 8.4.4 Advanced SPI Mode
      5. 8.4.5 Digital Data Output from the TPIC8101
    5. 8.5 Programming
      1. 8.5.1 Programming Examples
      2. 8.5.2 Programming in TEST Mode (TEST = 0)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Description (continued)

The data from the A/D enables the system to analyze the amount of retard timing for the next spark ignition timing cycle. With the microprocessor closed-loop system, advancing and retarding the spark timing optimizes the load/RPM conditions for a particular engine (data stored in RAM).