SLIS110C April   2003  – March 2015 TPIC8101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Functional Terminal Description
        1. 8.3.1.1  Supply Voltage (VDD)
        2. 8.3.1.2  Ground (GND)
        3. 8.3.1.3  Reference Supply (Vref)
        4. 8.3.1.4  Buffered Integrator Output (OUT)
        5. 8.3.1.5  Integration/Hold Mode Selection (INT/HOLD)
        6. 8.3.1.6  Chip Select for SPI (CS)
        7. 8.3.1.7  Oscillator Input (XIN)
        8. 8.3.1.8  Oscillator Output (XOUT)
        9. 8.3.1.9  Data Output (SDO)
        10. 8.3.1.10 Data Input (SDI)
        11. 8.3.1.11 Serial Clock (SCLK)
        12. 8.3.1.12 Test (TEST)
        13. 8.3.1.13 Feedback Output for Amplifiers (CH1FB and CH2FB)
        14. 8.3.1.14 Input Amplifiers (CH1P, CH1N, CH2P, and CH2N)
      2. 8.3.2 Timing Information
    4. 8.4 Device Functional Modes
      1. 8.4.1 System Transfer Equation
      2. 8.4.2 Programming in Normal Mode (TEST = 1)
      3. 8.4.3 Default SPI Mode
      4. 8.4.4 Advanced SPI Mode
      5. 8.4.5 Digital Data Output from the TPIC8101
    5. 8.5 Programming
      1. 8.5.1 Programming Examples
      2. 8.5.2 Programming in TEST Mode (TEST = 0)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

SOIC Package
(Top View)
TPIC8101 fpg_DW package_slis110.gif

Pin Functions

PIN TYPE
(PULLUP/PULLDOWN)		 DESCRIPTION
NAME NO.
VDD 1 I 5-V input supply
GND 2 I Ground connection
Vref 3 O Supply reference generator with external bypass capacitor
OUT 4 O Buffered integrator output
NC(1) 5 — No connection
6
INT/HOLD 7 I (pulldown) Selectable for integrate (high) or hold (low) mode (with internal pulldown)
CS 8 I (pullup) Chip select for SPI communications (active low with internal pullup)
XIN 9 I Inverter input for oscillator
XOUT 10 O Inverter output for oscillator
SDO 11 O Serial data output for SPI bus
SDI 12 I (pullup) Serial data input line
SCLK 13 I (pullup) SPI clock
TEST 14 I (pullup) Test mode (active low), open for normal operation
CH2P 15 I Positive input for amplifier 2
CH2N 16 I Negative input for amplifier 2
CH2FB 17 O Output of amplifier 2, for feedback connection
CH1FB 18 O Output of amplifier 1, for feedback connection
CH1N 19 I Negative input for amplifier 1
CH1P 20 I Positive input for amplifier 1
(1) These terminals are to be used for test purposes only and are not connected in the system application. No signal traces should be connected to the NC terminals.