SLIS134C March   2011  – September 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Operating Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Voltage Divider Mode
      3. 7.4.3 Rheostat Mode
    5. 7.5 Programming with I2C
      1. 7.5.1 I2C General Operation
        1. 7.5.1.1 I2C Interface
        2. 7.5.1.2 START and STOP Conditions
        3. 7.5.1.3 Data Validity and Byte Formation
        4. 7.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
      2. 7.5.2 I2C Write and Read Operation
        1. 7.5.2.1 Auto Increment Function
        2. 7.5.2.2 Write Operation
        3. 7.5.2.3 Repeated Start
        4. 7.5.2.4 Read Operation
    6. 7.6 Register Maps
      1. 7.6.1 Slave Address
      2. 7.6.2 TPL0102 Register Map
      3. 7.6.3 IVRA (Initial Value Register for Potentiometer A)
      4. 7.6.4 WRA (Wiper Resistance Register for Potentiometer A)
      5. 7.6.5 IVRB (Initial Value Register for Potentiometer B)
      6. 7.6.6 WRB (Wiper Resistance Register for Potentiometer B)
      7. 7.6.7 ACR (Access Control Register)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Adjustable Gain Non-Inverting Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Digital to Analog Converter (DAC)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Variable Current Sink
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Compensation Components
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Sequence
    2. 9.2 Wiper Position Upon Power Up
    3. 9.3 Dual-Supply vs Single-Supply
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.