SLIS144B September   2011  – February 2017

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Voltage Divider Mode
    5. 9.5 Programming
      1. 9.5.1 I2C General Operation and Overview
        1. 9.5.1.1 START and STOP Conditions
        2. 9.5.1.2 Data Validity and Byte Formation
        3. 9.5.1.3 Acknowledge (ACK) and Not Acknowledge (NACK)
        4. 9.5.1.4 Repeated Start
      2. 9.5.2 Programing with I2C
        1. 9.5.2.1 Write Operation
        2. 9.5.2.2 Read Operation
    6. 9.6 Register Maps
      1. 9.6.1 Slave Address
      2. 9.6.2 Register Address
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power Sequence
    2. 11.2 Power-On Reset Requirements
    3. 11.3 I2C Communication After Power Up
    4. 11.4 Wiper Position While Unpowered and After Power Up
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (March 2012) to B Revision

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Changed this data sheet to the new SDA format Go
  • Removed the obsolete TPL0401C device from the data sheetGo
  • Removed TPL0401C references Go
  • Changed TA max value to 125°C from 128°CGo
  • Deleted ILKG Go
  • Changed RH typical and max valuesGo
  • Changed IDD(STBY) measurement point from 85°C to 105°CGo
  • IIN-DIG min and max values increased Go
  • Added Rheostat mode parameters Go
  • Corrected typo to tOCF from tICF Go
  • Corrected typo to tVD(DATA) from tVD(ACK) Go
  • Updated Typical Characteristics graphs Go
  • Updated Resistance Values table Go
  • Added power supply recommendations Go

Changes from * Revision (September 2011) to A Revision

  • Added TPL0401C device to the Datasheet Go
  • Added TPL0401C Package Go
  • Added TPL0401C Functional Block DiagramGo