SNAS806 September   2020 TPL1401

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Standard Mode
    7. 6.7  Timing Requirements: I2C Fast Mode
    8. 6.8  Timing Requirements: I2C Fast Mode Plus
    9. 6.9  Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
    10. 6.10 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Potentiometer (Digipot) Architecture
        1. 7.3.1.1 Reference Selection and Digipot Transfer Function
          1. 7.3.1.1.1 Power Supply as Reference
          2. 7.3.1.1.2 Internal Reference
      2. 7.3.2 Digipot Update
      3. 7.3.3 Nonvolatile Memory (EEPROM or NVM)
        1. 7.3.3.1 NVM Cyclic Redundancy Check
          1. 7.3.3.1.1 NVM_CRC_ALARM_USER Bit
          2. 7.3.3.1.2 NVM_CRC_ALARM_INTERNAL Bit
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 Software Reset
      6. 7.3.6 Device Lock Feature
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
    5. 7.5 Programming
      1. 7.5.1 F/S Mode Protocol
      2. 7.5.2 I2C Update Sequence
      3. 7.5.3 Address Byte
      4. 7.5.4 Command Byte
      5. 7.5.5 I2C Read Sequence
    6. 7.6 Register Map
      1. 7.6.1 STATUS Register (address = D0h) (reset = 000Ch or 0014h)
      2. 7.6.2 GENERAL_CONFIG Register (address = D1h) (reset = 01F0h)
      3. 7.6.3 PROTECT Register (address = D3h) (reset = 0008h)
      4. 7.6.4 DPOT_POSITION Register (address = 21h) (reset = 0000h)
      5. 7.6.5 USER_BYTE1 Register (address = 25h) (reset = 0000h)
      6. 7.6.6 USER_BYTE2 Register (address = 26h) (reset = 0000h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPL1401
UNIT
DSG (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 49 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50 °C/W
RθJB Junction-to-board thermal resistance 24.1 °C/W
ΨJT Junction-to-top characterization parameter 1.1 °C/W
ΨJB Junction-to-board characterization parameter 24.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 8.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.