SNAS651A January   2015  – September 2018 TPL5010

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Ratings
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 WAKE
      2. 8.3.2 DONE
      3. 8.3.3 RSTn
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Normal Operating Mode
    5. 8.5 Programming
      1. 8.5.1 Configuring the WAKE Interval With the DELAY/M_RST Pin
      2. 8.5.2 Manual Reset
        1. 8.5.2.1 DELAY/M_RST
        2. 8.5.2.2 Circuitry
      3. 8.5.3 Timer Interval Selection Using External Resistance
      4. 8.5.4 Quantization Error
      5. 8.5.5 Error Due to Real External Resistance
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Supply Voltage (VDD-GND) –0.3 6 V
Input Voltage at any pin(3) –0.3 VDD + 0.3 V
Input Current on any pin –5 +5 mA
Junction Temperature, TJ(2) 150 °C
Storage Temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a printed-circuit board (PCB).
(3) The voltage between any two pins should not exceed 6V.