SNAS651A January   2015  – September 2018 TPL5010

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Ratings
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 WAKE
      2. 8.3.2 DONE
      3. 8.3.3 RSTn
    4. 8.4 Device Functional Modes
      1. 8.4.1 Start-Up
      2. 8.4.2 Normal Operating Mode
    5. 8.5 Programming
      1. 8.5.1 Configuring the WAKE Interval With the DELAY/M_RST Pin
      2. 8.5.2 Manual Reset
        1. 8.5.2.1 DELAY/M_RST
        2. 8.5.2.2 Circuitry
      3. 8.5.3 Timer Interval Selection Using External Resistance
      4. 8.5.4 Quantization Error
      5. 8.5.5 Error Due to Real External Resistance
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPL5010 UNIT
DDC (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 163 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26 °C/W
RθJB Junction-to-board thermal resistance 57 °C/W
ψJT Junction-to-top characterization parameter 7.5 °C/W
ψJB Junction-to-board characterization parameter 57 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).