SLRS074 May   2018 TPL7407LA-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simple Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inductive Load Drive
      2. 7.4.2 Resistive Load Drive
      3. 7.4.3 ON State Input Current
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Unipolar Stepper Motor Driver
      2. 8.1.2 Multi-Purpose Sink Driver
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 TTL and other Logic Inputs
        2. 8.2.2.2 Input RC Snubber
        3. 8.2.2.3 High-Impedance Input Drivers
        4. 8.2.2.4 Drive Current
        5. 8.2.2.5 Output Low Voltage
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Improving Package Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

at 25°C free-air temperature (unless otherwise noted) (1)
MIN MAX UNIT
VOUT Pins OUT1-OUT7 to GND voltage –0.3 32 V
VOK Output clamp diode reverse voltage(2) –0.3 32 V
VCOM COM pin voltage(2) –0.3 32 V
VIN Pins IN1-IN7 to GND voltage (2) –0.3 30 V
IDS Continuous drain current per channel(3)(4) 600 mA
IOK Output clamp current 500 mA
IGND Total continuous GND-pin current –2 A
TJ Operating virtual junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND/substrate pin, unless otherwise noted.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.