SLRS074 May   2018 TPL7407LA-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simple Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inductive Load Drive
      2. 7.4.2 Resistive Load Drive
      3. 7.4.3 ON State Input Current
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Unipolar Stepper Motor Driver
      2. 8.1.2 Multi-Purpose Sink Driver
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 TTL and other Logic Inputs
        2. 8.2.2.2 Input RC Snubber
        3. 8.2.2.3 High-Impedance Input Drivers
        4. 8.2.2.4 Drive Current
        5. 8.2.2.5 Output Low Voltage
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Improving Package Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Considerations

The number of coils driven is dependent on the coil current and on-chip power dissipation. The number of coils driven can be determined by Figure 3 or Figure 4.

For a more accurate determination of number of coils possible, use Equation 3 to calculate TPL7407LA-Q1 on-chip power dissipation PD:

Equation 3. TPL7407LA-Q1 eq1_lrs059.gif

where

  • N is the number of channels active together
  • VOLi is the OUTi pin voltage for the load current ILi. This is the same as VCE(SAT)

In order to guarantee reliability of TPL7407LA-Q1 and the system, the on-chip power dissipation must be lower than or equal to the maximum allowable power dissipation (PD(MAX)) dictated by below equation Equation 4.

Equation 4. TPL7407LA-Q1 eq2_lrs059.gif

where

  • TJ(MAX) is the target maximum junction temperature
  • TA is the operating ambient temperature
  • θJA is the package junction to ambient thermal resistance

It is recommended to limit rhe TPL7407LA-Q1 IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation.