SCPS304 September   2024 TPLD1201-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I/O Pins
      2. 7.3.2 Connection Mux
      3. 7.3.3 Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT Macro-Cell
        2. 7.3.3.2 3-Bit LUT Macro-Cell
        3. 7.3.3.3 2-Bit LUT or D Flip-Flop or Latch Macro-Cell
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop or Latch with Set or Reset Macro-Cell
        5. 7.3.3.5 3-Bit LUT or Pipe Delay Macro-cell
        6. 7.3.3.6 4-Bit LUT or 8-Bit Counter or Delay Macro-Cell
      4. 7.3.4 8-Bit Counters and Delay Generators (CNT/DLY)
        1. 7.3.4.1 Delay Mode
        2. 7.3.4.2 Reset Counter Mode
      5. 7.3.5 Programmable Deglitch Filter or Edge Detector Macro-cell
      6. 7.3.6 Selectable Frequency Oscillator
      7. 7.3.7 Analog Comparators (ACMP)
      8. 7.3.8 Voltage Reference (VREF)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Electrostatic Discharge Caution

TPLD1201-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.