SCPS304 September   2024 TPLD1201-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I/O Pins
      2. 7.3.2 Connection Mux
      3. 7.3.3 Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT Macro-Cell
        2. 7.3.3.2 3-Bit LUT Macro-Cell
        3. 7.3.3.3 2-Bit LUT or D Flip-Flop or Latch Macro-Cell
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop or Latch with Set or Reset Macro-Cell
        5. 7.3.3.5 3-Bit LUT or Pipe Delay Macro-cell
        6. 7.3.3.6 4-Bit LUT or 8-Bit Counter or Delay Macro-Cell
      4. 7.3.4 8-Bit Counters and Delay Generators (CNT/DLY)
        1. 7.3.4.1 Delay Mode
        2. 7.3.4.2 Reset Counter Mode
      5. 7.3.5 Programmable Deglitch Filter or Edge Detector Macro-cell
      6. 7.3.6 Selectable Frequency Oscillator
      7. 7.3.7 Analog Comparators (ACMP)
      8. 7.3.8 Voltage Reference (VREF)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

When using multiple-input and multiple-channel logic devices, inputs must never be left floating. In many cases, functions or parts of functions of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such unused input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. All unused inputs of digital logic devices must be connected to a logic high or logic low voltage, as defined by the input voltage specifications, to prevent them from floating. The logic level that must be applied to any particular unused input depends on the function of the device. Generally, the inputs are tied to GND or VCC, whichever makes more sense for the logic function or is more convenient.