SCPS304 September   2024 TPLD1201-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Supply Current Characteristics
    7. 5.7 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I/O Pins
      2. 7.3.2 Connection Mux
      3. 7.3.3 Configurable Use Logic Blocks
        1. 7.3.3.1 2-Bit LUT Macro-Cell
        2. 7.3.3.2 3-Bit LUT Macro-Cell
        3. 7.3.3.3 2-Bit LUT or D Flip-Flop or Latch Macro-Cell
        4. 7.3.3.4 3-Bit LUT or D Flip-Flop or Latch with Set or Reset Macro-Cell
        5. 7.3.3.5 3-Bit LUT or Pipe Delay Macro-cell
        6. 7.3.3.6 4-Bit LUT or 8-Bit Counter or Delay Macro-Cell
      4. 7.3.4 8-Bit Counters and Delay Generators (CNT/DLY)
        1. 7.3.4.1 Delay Mode
        2. 7.3.4.2 Reset Counter Mode
      5. 7.3.5 Programmable Deglitch Filter or Edge Detector Macro-cell
      6. 7.3.6 Selectable Frequency Oscillator
      7. 7.3.7 Analog Comparators (ACMP)
      8. 7.3.8 Voltage Reference (VREF)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPLD1201 UNIT
DGS (VSSOP)
10-PIN
RθJA Junction-to-ambient thermal resistance 152.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.8 °C/W
RθJB Junction-to-board thermal resistance 88.9 °C/W
ΨJT Junction-to-top characterization parameter 4.8 °C/W
ΨJB Junction-to-board characterization parameter 87.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.