SLUSFA1 September   2024 TPS1214-Q1

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge Pump and Gate Driver Output (VS, GATE, BST, SRC)
      2. 8.3.2 Capacitive Load Driving
        1. 8.3.2.1 Using Low Power Bypass FET (G Drive) for Load Capacitor Charging
        2. 8.3.2.2 Using Main FET (GATE drive) Gate Slew Rate Control
      3. 8.3.3 Overcurrent and Short-Circuit Protection
        1. 8.3.3.1 I2t-Based Overcurrent Protection
          1. 8.3.3.1.1 I2t-Based Overcurrent Protection With Auto-Retry
          2. 8.3.3.1.2 I2t-Based Overcurrent Protection With Latch-Off
        2. 8.3.3.2 Short-Circuit Protection
      4. 8.3.4 Analog Current Monitor Output (IMON)
      5. 8.3.5 NTC based Temperature Sensing (TMP) and Analog Monitor Output (ITMPO)
      6. 8.3.6 Fault Indication and Diagnosis (FLT, SCP_TEST)
      7. 8.3.7 Reverse Polarity Protection
      8. 8.3.8 Undervoltage Protection (UVLO)
    4. 8.4 Device Functional Modes
      1. 8.4.1 State Diagram
      2. 8.4.2 State Transition Timing Diagram
      3. 8.4.3 Power Down
      4. 8.4.4 Shutdown Mode
      5. 8.4.5 Low Power Mode (LPM)
      6. 8.4.6 Active Mode (AM)
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application 1: Driving Power at all times (PAAT) Loads With Automatic Load Wakeup
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application 2: Driving Power at all times (PAAT) Loads With Automatic Load Wakeup and Output Bulk Capacitor Charging
      1. 9.3.1 Design Requirements
      2. 9.3.2 External Component Selection
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

Selection of Current Sense Resistor, RSNS

The recommended range of the I2t based overcurrent protection threshold voltage, V(SNS_OCP), extends from 6mV to 200mV. Values near the low threshold of 6mV can be affected by the system noise. Values near the upper threshold of 200mV can cause high power dissipation in the current sense resistor. To minimize both the concerns, 20mV is selected as the I2t protection start threshold voltage. The current sense resistor, RSNS can be calculated using following equation:

Equation 18. R S N S = V ( S N S _ O C P ) I O C  

For 40A (IOC) of I2t protection start threshold, RSNS is calculated to be 0.5mΩ,

Two of 1mΩ, 1% sense resistor can be used in parallel.

Selection of IMON Scaling Resistor, RSET

RSET is the resistor connected between VS or input supply and CS1+ pins. This resistor scales the I2t based overcurrent protection threshold voltage and coordinates with RIOC, charging current on CI2t and RIMON to determine the I2t profile and current monitoring output.

The maximum current on I2t pin can be calculated based on short-circuit protection (ISC) threshold based on following equation:

Equation 19. I I 2 t _ M A X   ( µ A ) =   K   × I S C 2

where scaling factor, K can be calculate based on below equation:

Equation 20. S c a l i n g   f a c t o r   ( K ) = 0.1   × R S N S R S E T   2 I B I A S

RSET needs to adjusted so that II2t_MAX is always less than 100µA. The recommended range of RSET is 100Ω–500Ω.

RSET is selected as 300Ω, 1% for this design example to get I2t_MAX current < 100µA.

Choosing the Current Monitoring Resistor, RIMON

Voltage at IMON pin V(IMON) is proportional to the output load current. This can be connected to an ADC of the downstream system for monitoring the operating condition and health of the system. The RIMON must be selected based on the maximum load current and the input voltage range of the ADC used. RIMON is set using following equation:

Equation 21. V ( I M O N )   =   ( V S N S   +   V ( V O S _ S E T ) )   ×   0.9   ×   R I M O N R S E T

Where VSNS = IOC_MAX × RSNS and V(OS_SET) is the input referred offset (±150µV) of the current sense amplifier. For IOC_MAX = 120A and considering the operating range of ADC to be 0V to 3.3V (for example, V(IMON) = 3.3V), RIMON is calculated to be 18.33kΩ.

Selecting RIMON value less than shown in Equation 21 ensures that ADC limits are not exceeded for maximum value of load current. Choose the closest available standard value: 18.2kΩ, 1%

Selection of Main path MOSFETs, Q1 and Q2

Q1 and Q2 For selecting the MOSFET Q1 and Q2, important electrical parameters are the maximum continuous drain current ID, the maximum drain-to-source voltage VDS(MAX), the maximum drain-to-source voltage VGS(MAX), and the drain-to-source ON resistance RDS(ON). The maximum continuous drain current, ID, rating must exceed the maximum continuous load current. The maximum drain-to-source voltage, VDS(MAX), must be high enough to withstand the highest voltage seen in the application. Considering 35V as the maximum application voltage due to load dump, MOSFETs with VDS voltage rating of 40V is chosen for this application.

The maximum VGS TPS1214-Q1 can drive is 12V, so a MOSFET with 15V minimum VGS rating must be selected.

To reduce the MOSFET conduction losses, an appropriate RDS(ON) is preferred. Based on the design requirements, two of BUK7J1R4-40H are selected and its ratings are:

  • 40V VDS(MAX) and ±20V VGS(MAX)
  • RDS(ON) is 1.06mΩ typical at 10V VGS
  • MOSFET Qg(total) is 73nC typical

TI recommends to make sure that the short-circuit conditions such VBATT_MAX and ISC are within SOA of selected FETs (Q1 and Q2) for > tSC (5μs max) timing.

Selection of Bootstrap Capacitor, CBST

The internal charge pump charges the external bootstrap capacitor (connected between BST and SRC pins) with approximately 600μA. Use the following equation to calculate the minimum required value of the bootstrap capacitor for driving two parallel BUK7J1R4-40H MOSFETs.

Equation 22. C B S T   =   Q g ( t o t a l ) 1   V

Choose closest available standard value: 150nF, 10 %.

Programming the I2T Profile, RIOC and CI2t Selection

The RIOC sets the I2T protection start threshold, whose value can be calculated using following equation:

Equation 23. R I O C   ( Ω ) = V ( R E F _ O C ) K   ×   I O C 2  

where scaling factor, K can be calculate based on below equation:

Equation 24. S c a l i n g   f a c t o r   ( K ) = 0.1   × R S N S R S E T   2 I B I A S

To set 40A as I2T protection start threshold, RIOC value is calculated to be 23kΩ.

Choose the closest available standard value: 23kΩ, 1%.

The time to turn OFF the gate drive at maximum overcurrent limit (IOC_MAX) can be determined using below equation:

Equation 25. tOC_MIN (s)=I2T factorIOC_MAX × IOC_MAX 

To set 3000A2s as I2T factor, tOC_MIN value is calculated to be 208ms.

Use Equation 26 to calculate the required CI2t value:

Equation 26. C I 2 t   ( F ) = K   ×   t O C _ M I N V ( I 2 t _ O C )   -   V ( I 2 t _ O F F S E T )   ×   I O C _ M A X 2   -   I O C 2

To set 3000A2s as I2T factor with 40A as I2T start threshold and 120A as maximum overcurrent, CI2t is calculated to be ~880nF.

Choose the closest available standard value: 1µF, 10%.

Programming the Short-Circuit Protection Threshold, RISCP Selection

The RISCP sets the short-circuit protection threshold, whose value can be calculated using following equation:

Equation 27. R I S C P   ( k Ω ) = I S C   ×   R S N S   -   1.8 I S C P

To set 130A as short-circuit protection threshold, RISCP value is calculated to be 2.53kΩ for two FETs in parallel. Choose the closest available standard value: 2.55kΩ, 1%.

Programming the Fault Timer Period, CTMR Selection

For the design example under discussion, the auto-retry time, tRETRY can be set by selecting appropriate capacitor CTMR from TMR pin to ground. The value of CTMR to set 1ms for tRETRY can be calculated using following equation:

Equation 28. t R E T R Y   ( s ) =   64   ×   C T M R   ×   V ( T M R _ H I G H )   -   V ( T M R _ L O W ) I ( T M R _ S R C )  

To set 1000ms as auto-retry time, CTMR value is calculated to be 39.06nF.

Choose closest available standard value: 47nF, 10%.

Programming the Load Wakeup Threshold, RBYPASS and Q3 Selection

During normal operation, the resistor RBYPASS along with bypass FET RDSON is used to set load wakeup current threshold. For selecting the MOSFET Q3, important electrical parameters are the maximum continuous drain current ID, the maximum drain-to-source voltage VDS(MAX), the maximum drain-to-source voltage VGS(MAX), and the drain-to-source ON resistance RDS(ON).

Based on the design requirements, BUK6D23-40E is selected and its ratings are:

  • 40V VDS(MAX) and ±20V VGS(MAX)
  • RDS(ON) is 17mΩ typical at 10V VGS
  • MOSFET Qg(total) is 11nC typical
  • MOSET VGS(th) is 1.3V min
  • MOSFET CISS is 582pF typical

Setting the Undervoltage Lockout Set Point, R3 and R4

The undervoltage lockout (UVLO) can be adjusted using an external voltage divider network of R3 and R4 connected between VS, EN/UVLO and GND pins of the device. The values required for setting the undervoltage and overvoltage are calculated by solving below equation:

Equation 29. V ( U V L O R )   =   V I N U V L O   ×   R 4 R 3   +   R 4

For minimizing the input current drawn from the power supply, TI recommends to use higher values of resistance for R3 and R4. However, leakage currents due to external active components connected to the resistor string can add error to these calculations. So, the resistor string current, I(R34) must be chosen to be 20 times greater than the leakage current of UVLO pin.

From the device electrical specifications, V(UVLOR) = 1.2V. From the design requirements, VINUVLO is 6.5V. To solve the equation, first choose the value of R3 = 470kΩ and use Equation 29 to solve for R4 = 107.5kΩ.

Choose the closest standard 1% resistor values: R3 = 470kΩ, and R4 = 107kΩ.