SLVSGF4B june   2022  – may 2023 TPS1641

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Enable and Shutdown Input (EN/SHDN)
      2. 8.3.2  Overvoltage Protection (OVP)
      3. 8.3.3  Output Slew Rate and Inrush Current Control (dVdt)
      4. 8.3.4  Active Current Limiting (ILIM) With the TPS16412, TPS16413, TPS16416, and TPS16417
      5. 8.3.5  Active Power Limiting (PLIM) With the TPS16410, TPS16411, TPS16414, and TPS16415
        1. 8.3.5.1 Internal Current Limit for the TPS16410 and TPS16411
      6. 8.3.6  Overcurrent Protection (IOCP) and Blanking Time (IDLY or PDLY) for Transient Loads
      7. 8.3.7  Fast-Trip and Short-Circuit Protection
      8. 8.3.8  Analog Load Current Monitor (IMON) on the IOCP Pin
      9. 8.3.9  IN to OUT Short Detection (TPS16410, TPS16411, TPS16412, and TPS16413)
      10. 8.3.10 Thermal Shutdown and Overtemperature Protection
      11. 8.3.11 Fault Response and Indication (FLT)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: 15-W Power Limiting for Low Power Circuits (LPCs)
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting Overvoltage Setpoints
        2. 9.2.2.2 Setting the Output Overcurrent Setpoint (IOCP)
        3. 9.2.2.3 Setting the Output Power Limit
        4. 9.2.2.4 Monitoring the Output Current
        5. 9.2.2.5 Limiting the Inrush Current and Setting the Output Slew Rate
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Accurate Power or Current Limiting at the Output of DC/DC or Flyback Converter
    4. 9.4 Best Design Practices
    5. 9.5 Power Supply Recommendations
      1. 9.5.1 Transient Protection
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS1641 UNIT
DRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 43.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.0 °C/W
RθJB Junction-to-board thermal resistance 15.8 °C/W
ΨJT Junction-to-top characterization parameter 1.1 °C/W
ΨJB Junction-to-board characterization parameter 15.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.