SLVSG57 August   2021 TPS1653

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Hot Plug-In and In-Rush Current Control
        1. 8.3.1.1 Thermal Regulation Loop
      2. 8.3.2  Undervoltage Lockout (UVLO)
      3. 8.3.3  Overload and Short Circuit Protection
        1. 8.3.3.1 Overload Protection
        2. 8.3.3.2 Short Circuit Protection
          1. 8.3.3.2.1 Start-Up With Short-Circuit On Output
      4. 8.3.4  Current Monitoring Output (IMON)
      5. 8.3.5  FAULT Response (FLT)
      6. 8.3.6  Power Good Output (PGOOD)
      7. 8.3.7  IN, P_IN, OUT and GND Pins
      8. 8.3.8  Thermal Shutdown
      9. 8.3.9  Low Current Shutdown Control (SHDN)
      10. 8.3.10 Enable Input (EN)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Current-Limit Threshold R(ILIM) Selection
        2. 9.2.2.2 Undervoltage Lockout and Overvoltage Set Point
        3. 9.2.2.3 Setting Output Voltage Ramp Time (tdVdT)
          1. 9.2.2.3.1 Support Component Selections RPGOOD and C(IN)
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 48-V Power Amplifier Protection for Telecom Radios
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

  • For all the applications, a 0.1 µF or higher value ceramic decoupling capacitor is recommended between IN terminal and GND.
  • High current carrying power path connections must be as short as possible and must be sized to carry at least twice the full-load current. See Figure 11-1 and Figure 11-2 for a typical PCB layout example.
  • Locate all the TPS16530 device support components R(ILIM), C(dVdT), R(IMON), UVLO resistors close to the device pin. Connect the other end of the component to the GND with shortest trace length.
  • The trace routing for the R(ILIM) component to the device must be as short as possible to reduce parasitic effects on the current limit accuracy. These traces must not have any coupling to switching signals on the board.
  • Protection devices such as TVS, snubbers, capacitors, or diodes must be placed physically close to the device they are intended to protect and routed with short traces to reduce inductance. For example, a protection Schottky diode is recommended to address negative transients due to switching of inductive loads, and it must be physically close to the OUT and GND pins.
  • Thermal Considerations: When properly mounted, the PowerPAD package provides significantly greater cooling ability. To operate at rated power, the PowerPAD must be soldered directly to the board GND plane directly under the device. Other planes, such as the bottom side of the circuit board, can be used to increase heat sinking in higher current applications.