SLVSG57 August   2021 TPS1653

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Hot Plug-In and In-Rush Current Control
        1. 8.3.1.1 Thermal Regulation Loop
      2. 8.3.2  Undervoltage Lockout (UVLO)
      3. 8.3.3  Overload and Short Circuit Protection
        1. 8.3.3.1 Overload Protection
        2. 8.3.3.2 Short Circuit Protection
          1. 8.3.3.2.1 Start-Up With Short-Circuit On Output
      4. 8.3.4  Current Monitoring Output (IMON)
      5. 8.3.5  FAULT Response (FLT)
      6. 8.3.6  Power Good Output (PGOOD)
      7. 8.3.7  IN, P_IN, OUT and GND Pins
      8. 8.3.8  Thermal Shutdown
      9. 8.3.9  Low Current Shutdown Control (SHDN)
      10. 8.3.10 Enable Input (EN)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Current-Limit Threshold R(ILIM) Selection
        2. 9.2.2.2 Undervoltage Lockout and Overvoltage Set Point
        3. 9.2.2.3 Setting Output Voltage Ramp Time (tdVdT)
          1. 9.2.2.3.1 Support Component Selections RPGOOD and C(IN)
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 48-V Power Amplifier Protection for Telecom Radios
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS16530 UNIT
RGE (VQFN) PWP (HTSSOP)
24 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 32.1 31.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26 22.5 °C/W
RθJB Junction-to-board thermal resistance 9.8 8.9 °C/W
ΨJT Junction-to-top characterization parameter 0.3 0.3 °C/W
ΨJB Junction-to-board characterization parameter 9.7 8.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3 1.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.