SLVSCM2D October   2014  – December 2019 TPS1H100-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements – Current Sense Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Accurate Current Sense
      2. 7.3.2 Programmable Current Limit
      3. 7.3.3 Inductive-Load Switching-Off Clamp
      4. 7.3.4 Full Protections and Diagnostics
        1. 7.3.4.1  Short-to-GND and Overload Detection
        2. 7.3.4.2  Open-Load Detection
        3. 7.3.4.3  Short-to-Battery Detection
        4. 7.3.4.4  Reverse-Polarity Detection
        5. 7.3.4.5  Thermal Protection Behavior
        6. 7.3.4.6  UVLO Protection
        7. 7.3.4.7  Loss of GND Protection
        8. 7.3.4.8  Loss of Power Supply Protection
        9. 7.3.4.9  Reverse Current Protection
        10. 7.3.4.10 Protection for MCU I/Os
      5. 7.3.5 Diagnostic Enable Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Distinguishing of Different Fault Modes
        2. 8.2.2.2 AEC Q100-012 Test Grade A Certification
        3. 8.2.2.3 EMC Transient Disturbances Test
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Without a GND Network
      2. 10.2.2 With a GND Network
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements – Current Sense Characteristics(1)

MIN NOM MAX UNIT
tCS,off1 CS settling time from DIAG disabled VIN = 5 V, Iload ≥ 5 mA. VDIAG_EN from 5 to 0 V. CS to 10% of sense value. 10 µs
tCS,on1 CS settling time from DIAG enabled VIN = 5 V, Iload ≥ 5 mA. VDIAG_EN from 0 to 5 V. CS to 90% of sense value. 10 µs
tCS,off2 CS settling time from IN falling edge VDIAG_EN = 5 V, Iload ≥ 5 mA. IN from 5 to 0 V. CS to 10% of sense value. 10 µs
VDIAG_EN = 5 V, Iload ≥ 5 mA. IN from 5 to 0 V. Current limit triggered. 180 µs
tCS,on2 CS settling time from IN rising edge VVS = 13.5 V, VDIAG_EN = 5 V, Iload ≥ 100 mA. VIN from 0 to 5 V. CS to 90% of sense value. 150 µs
(1) Value specified by design, not subject to production test.
TPS1H100-Q1 tim_CS_delay_lvscm2.gifFigure 2. CS Delay Characteristics
TPS1H100-Q1 tim_open_lvscm2.gifFigure 3. Open-Load Blanking Time Characteristics
TPS1H100-Q1 conventions_lvscm2.gifFigure 4. Pin Current and Voltage Conventions