SLVSE16C May 2019 – January 2020 TPS1HB08-Q1
PRODUCTION DATA.
THERMAL METRIC (1) (2) | TPS1HB08-Q1 | UNIT | |
---|---|---|---|
PWP (HTSSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 32.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 25.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 9.2 | °C/W |
ψJT | Junction-to-top characterization parameter | 2.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 9.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.0 | °C/W |