SLVSGL6A July   2022  – December 2022 TPS1HC30-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Accurate Current Sense
      2. 8.3.2 Programmable Current Limit
        1. 8.3.2.1 Capacitive Charging
      3. 8.3.3 Inductive-Load Switching-Off Clamp
      4. 8.3.4 Full Protections and Diagnostics
        1. 8.3.4.1  Short-Circuit and Overload Protection
        2. 8.3.4.2  Open-Load and Short-to-Battery Detection
        3. 8.3.4.3  Short-to-Battery Detection
        4. 8.3.4.4  Reverse-Polarity and Battery Protection
        5. 8.3.4.5  Latch-Off Mode
        6. 8.3.4.6  Thermal Protection Behavior
        7. 8.3.4.7  UVLO Protection
        8. 8.3.4.8  Loss of GND Protection
        9. 8.3.4.9  Loss of Power Supply Protection
        10. 8.3.4.10 Reverse Current Protection
        11. 8.3.4.11 Protection for MCU I/Os
      5. 8.3.5 Diagnostic Enable Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Dynamically Changing Current Limit
        2. 9.2.2.2 EMC Transient Disturbances Test
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
      3. 9.4.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

Figure 5-1 PWP Package, 14-Pin HTSSOP (Top View)
Table 5-1 Pin Functions
PINTYPEDESCRIPTION
NO.NAME
1GNDPowerGround of device. Connect to resistor-diode ground network to have reverse battery protection.
2ENIInput control for channel activation, internal pulldown
3DIAG_ENIEnable-disable pin for diagnostics, internal pulldown
4FAULTOOpen-drain global fault output. Referred to FAULT, FLT, or fault pin.
5LATCHIThermal shutdown behavior, latch-off or auto-retry, internal pulldown
6SNSOOutput corresponding sense value based on sense ratio
7ILIMOAdjustable current limit. Short to ground or leave floating if external current limit is not used.
8, 11, 14NCN/ANo internal connection
9, 10VOUTPowerOutput of high-side switch, connected to load
12, 13VBBPowerPower supply
Thermal PadPadThermal Pad, internally shorted to ground

Recommended Connection for Unused Pins

The TPS1HC30-Q1 is designed to provide an enhanced set of diagnostic and protection features. However, if the system design only allows for a limited number of I/O connections, some pins can be considered as optional.

Table 5-2 Connections For Optional Pins
PIN NAME CONNECTION IF NOT USED IMPACT IF NOT USED
SNS Ground through 1-kΩ resistor Analog sense is not available.
LATCH Float or ground through RPROT resistor With LATCH unused, the device auto-retries after a fault. If latched behavior is desired, but the system describes limited I/O, it is possible to use one microcontroller output to control the latch function of several high side channels.
ILIM Float If the ILIM pin is left floating, the device is set to the default internal current-limit threshold. This impact is considered a fault state for the device.
DIA_EN Float or ground through RPROT resistor With DIA_EN unused, the analog sense, open-load, and short-to-battery diagnostics are not available.