SLVSGL4 September   2023 TPS1HTC30-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Recommended Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Accurate Current Sense
      2. 8.3.2 Programmable Current Limit
        1. 8.3.2.1 Capacitive Charging
      3. 8.3.3 Inductive-Load Switching-Off Clamp
      4. 8.3.4 Inductive Load Demagnetization
      5. 8.3.5 Full Protections and Diagnostics
        1. 8.3.5.1 Short-Circuit and Overload Protection
        2. 8.3.5.2 Open-Load Detection
        3. 8.3.5.3 Thermal Protection Behavior
        4. 8.3.5.4 Overvoltage (OVP) Protection
        5. 8.3.5.5 UVLO Protection
        6. 8.3.5.6 Reverse Polarity Protection
        7. 8.3.5.7 Protection for MCU I/Os
      6. 8.3.6 Diagnostic Enable Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Dynamically Changing Current Limit
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
        3. 9.4.2.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.5.1 Short-Circuit and Overload Protection

TPS1HTC30-Q1 provides output short-circuit protection to make sure that the device prevents current flow in the event of a low impedance path to GND, removing the risk of damage or significant supply droop. The device is specified to protect against short-circuit events regardless of the state of the ILIM pins and with up to 60-V supply at 125°C.

Figure 8-8 shows the behavior of TPS1HTC30-Q1 when a short-circuit occurs and the device is in the on-state and already outputting current. When the internal pass FET is fully enabled, the current clamping settling time is slower so to make sure overshoot is limited, the device implements a fast trip level at a level IOVCR. When this fast trip threshold is hit, the device immediately shuts off for a short period of time before quickly re-enabling and clamping the current to ICL level after a brief transient overshoot to the higher peak current (ICL_ENPS) level. The device then keeps the current clamped at the regulation current limit until the thermal shutdown temperature is hit and the device safely shuts off.

GUID-20230921-SS0I-W1MD-FBR9-3XSPVQ6800LP-low.svg Figure 8-8 On-State Short-Circuit Behavior

Overload Behavior shows the behavior of the TPS1HTC30-Q1 when there is a small change in impedance that sends the load current above the ICL threshold. The current rises to ICL_LINPK above the regulation level. Then the current limit regulation loop kicks in and the current drops to the ICL value.

GUID-20230921-SS0I-CG9V-PJVD-KD2VLVWP8WPQ-low.svg Figure 8-9 Overload Behavior

In all of these cases, the internal thermal shutdown is safe to hit repetitively. There is no device risk or lifetime reliability concerns from repeatedly hitting this thermal shutdown level.