SLVSGL4 September   2023 TPS1HTC30-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Recommended Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Accurate Current Sense
      2. 8.3.2 Programmable Current Limit
        1. 8.3.2.1 Capacitive Charging
      3. 8.3.3 Inductive-Load Switching-Off Clamp
      4. 8.3.4 Inductive Load Demagnetization
      5. 8.3.5 Full Protections and Diagnostics
        1. 8.3.5.1 Short-Circuit and Overload Protection
        2. 8.3.5.2 Open-Load Detection
        3. 8.3.5.3 Thermal Protection Behavior
        4. 8.3.5.4 Overvoltage (OVP) Protection
        5. 8.3.5.5 UVLO Protection
        6. 8.3.5.6 Reverse Polarity Protection
        7. 8.3.5.7 Protection for MCU I/Os
      6. 8.3.6 Diagnostic Enable Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Dynamically Changing Current Limit
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
        3. 9.4.2.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Detailed Design Procedure

To keep maximum voltage on the SNS pin at an acceptable range for the system, use the following equation to calculate the RSNS. To achieve better current sense accuracy. A 1% accuracy or better resistor is preferred.

Equation 11. (VSNSFH – VHR) × KSNS / ILOAD,max ≤ RSNS ≤ VADC,min × KSNS / ILOAD,min

Table 9-1 Typical Application

Parameter

Value

VDIAG_EN

5 V

ILOAD,max

6 A

ILOAD,min

20 mA

VADC,min

5 mV

VHR

1 V
For this application, an RSNS value of approximately 1 kΩ can be chosen to satisfy the equation requirements.

Equation 12. (5 V – 1 V) × 1300 / 6 A ≤ ≅1 kΩ ≤ 5 mV × 1300 / 20 mA

In other applications, more emphasis can be put on the lower end measurable values which increases RSNS. Likewise, if the higher currents are of more interest the RSNS can be decreased.

Having the maximum SNS voltage scale with the DIAG_EN voltage removes the need for a Zener diode on the SNS pin going to the ADC.

To set the programmable current limit value at 5 A, use the following equation to calculate the RLIM.

Equation 13. RLIM = KCL / ILIM = 100 / 5 = 20 kΩ

TI recommends RPROT = 10 kΩ to ensure the current going into the digital pins (EN, DIAG_EN, LATCH) is limited.

TI recommends a 1-kΩ resistor and 600-V, 0.2-A diode for the GND network.