SLVSGL4 September   2023 TPS1HTC30-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Recommended Connections for Unused Pins
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Accurate Current Sense
      2. 8.3.2 Programmable Current Limit
        1. 8.3.2.1 Capacitive Charging
      3. 8.3.3 Inductive-Load Switching-Off Clamp
      4. 8.3.4 Inductive Load Demagnetization
      5. 8.3.5 Full Protections and Diagnostics
        1. 8.3.5.1 Short-Circuit and Overload Protection
        2. 8.3.5.2 Open-Load Detection
        3. 8.3.5.3 Thermal Protection Behavior
        4. 8.3.5.4 Overvoltage (OVP) Protection
        5. 8.3.5.5 UVLO Protection
        6. 8.3.5.6 Reverse Polarity Protection
        7. 8.3.5.7 Protection for MCU I/Os
      6. 8.3.6 Diagnostic Enable Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Dynamically Changing Current Limit
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Without a GND Network
        2. 9.4.2.2 With a GND Network
        3. 9.4.2.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Switching Characteristics

VS = 48 V, RL = 120 Ω, TA = -40°C to 125°C (unless otherwise noted)
Parameter Test Conditions Min Typ Max
Unit
tDR Turnon delay time (from standby) 50% of EN to 20% of VOUT 30 60 82.5 µs
tDR Turnon delay time (from active) 50% of EN to 20% of VOUT 30 50 72.5 µs
tDF Turnoff delay time 50% of EN to 80% of VOUT 55 95 135 µs
SRR VOUT rising slew rate 20% to 80% of VOUT 0.2 0.45 0.8 V/µs
SRF VOUT falling slew rate 80% to 20% of VOUT 0.2 0.55 0.9 V/µs
fmax Maximum PWM frequency 750 Hz
tON Turnon time 50% of EN to 80% of VOUT 125 200 µs
tOFF Turnoff time 50% of EN to 20% of VOUT 145 230 µs
tON - tOFF Turnon and off matching 1ms ON time switch enable pulse –25 25 µs
200-µs enable pulse
F = fmax 		 –25 25 µs
tOFF_pw Minimum VOUT ON pulse width 200-µs OFFtime switch enable pulse, VOUT @ 20% of VS, F = fmax 70 160 µs
ΔPWM PWM accuracy - average load current 300-µs enable pulse
F = fmax		 –15 15 %
EON Switching energy losses during turnon 1 ms pulse, VOUT from 10% to 90% of VS voltage 0.3 0.4 mJ
EOFF Switching energy losses during turnoff 1 ms pulse, VOUT from 10% to 90% of VS voltage 0.25 0.35 mJ