SLVSGZ7B May   2023  – October 2023 TPS2000E , TPS2001E , TPS2068E , TPS2069E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6.     13
    7. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable
      3. 7.3.3 Internal Charge Pump
      4. 7.3.4 Current Limit
      5. 7.3.5 FLT
      6. 7.3.6 Output Discharge
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitance
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS20xxE UNIT
DBV (SOT-23) DGN (HVSSOP)
PowerPAD™		 DGK (VSSOP)
5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 184.6 51.7 169.6 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 92.6 82.7 65.5
RθJB Junction-to-board thermal resistance 59.9 25.2 90.5
ΨJT Junction-to-top characterization parameter 30.7 6.5 11.8
ΨJB Junction-to-board characterization parameter 59.6 25.2 89.0
RθJC(bot) Junction-to-case (bottom) thermal resistance - 6.4 -
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.