SLVS782D November   2007  – October 2020 TPS2041B-Q1 , TPS2042B-Q1 , TPS2051B-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Switch
      2. 8.3.2 Charge Pump
      3. 8.3.3 Driver
      4. 8.3.4 Enable ( ENx)
      5. 8.3.5 Enable (EN)
      6. 8.3.6 Overcurrent ( OCx)
      7. 8.3.7 Current Sense
      8. 8.3.8 Thermal Sense
      9. 8.3.9 Undervoltage Lockout (UVLO)
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Universal Serial Bus (USB) Applications
    2. 9.2 Typical Applications
      1. 9.2.1 TPS2042B-Q1 Typical Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Overcurrent
          2. 9.2.1.2.2 OC Response
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Hosts and Self-Powered Hubs and Bus-Powered Hubs
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 USB Power-Distribution Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Low-Power Bus-Powered and High-Power Bus-Powered Functions
      3. 9.2.3 Generic Hot-Plug Applications
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over recommended operating junction temperature range, VI(IN) = 5.5 V, IO = 0.5 A, VI( ENx) = 0 V (unless otherwise noted)
PARAMETERTEST CONDITIONS(1)MINTYPMAXUNIT
POWER SWITCH
rDS(ON)Static drain-source on-state resistance, 5V or 3.3-V operationVI(IN) = 5 V or 3.3 V,
IO = 0.5 A
–40°C ≤ TJ ≤ 125°C105160
Static drain-source on-state resistance, 2.7-V operation(2)VI(IN) = 2.7 V, IO = 0.5 A–40°C ≤ TJ ≤ 125°C110175
trRise time, output(2)VI(IN) = 5.5 VCL = 1 µF,
RL = 10 Ω
TJ = 25°C0.61.5ms
VI(IN) = 2.7 V0.41
tfFall time, output(2)VI(IN) = 5.5 VCL = 1 µF,
RL = 10 Ω
TJ = 25°C0.050.5ms
VI(IN) = 2.7 V0.050.5
ENABLE INPUT ( EN, ENx)
VIHHigh-level input voltage2.7 V ≤ VI(IN) ≤ 5.5 V2V
VILLow-level input voltage2.7 V ≤ VI(IN) ≤ 5.5 V0.8
IIInput currentVI( ENx) = 0 V or 5.5 V–0.50.5µA
tonTurnon time(2)CL = 100 µF, RL = 10 Ω3ms
toffTurnoff time(2)CL = 100 µF, RL = 10 Ω10
CURRENT LIMIT
IOSShort-circuit output currentVI(IN) = 5 V, OUT connected to GND,
device enabled into short-circuit
TJ = 25°C0.6511.25A
–40°C ≤ TJ ≤ 125°C0.611.3
SUPPLY CURRENT (TPS2041B-Q1, TPS2051B-Q1)
Supply current, low-level outputNo load on OUT,
VI( EN) = 5.5 V or VI(EN) = 0 V
TJ = 25°C0.51µA
–40°C ≤ TJ ≤ 125°C0.55
Supply current, high-level outputNo load on OUT,
VI( EN) = 0 V or VI(EN) = 5.5 V
TJ = 25°C4360µA
–40°C ≤ TJ ≤ 125°C4370
Leakage currentOUT connected to ground,
VI( EN) = 5.5 V or VI(EN) = 0 V
–40°C ≤ TJ ≤ 125°C1µA
Reverse leakage currentVI(OUTx) = 5.5 V, IN = ground(2)TJ = 25°C0µA
SUPPLY CURRENT (TPS2042B-Q1)
Supply current, low-level outputNo load on OUT, VI( ENx) = 5.5 VTJ = 25°C0.51µA
–40°C ≤ TJ ≤ 125°C0.55
Supply current, high-level outputNo load on OUT, VI( ENx) = 0 VTJ = 25°C5070µA
–40°C ≤ TJ ≤ 125°C5090
Leakage currentOUT connected to ground, VI( ENx) = 5.5 V–40°C ≤ TJ ≤ 125°C1µA
Reverse leakage currentVI(OUTx) = 5.5 V, IN = ground(2)TJ = 25°C0.2µA
UNDERVOLTAGE LOCKOUT
Low-level input voltage, IN, INx22.5V
Hysteresis, IN, INxTJ = 25°C75mV
OVERCURRENT ( OC, OCx)
Output low voltage, VOL( OCx)IO( OCx) = 5 mA0.4V
OFF-state current(2)VO( OCx) = 5 V or 3.3 V1µA
OC deglitch(2)OCx assertion or deassertion4815ms
THERMAL SHUTDOWN(3)
Thermal shutdown threshold(2)135°C
Recovery from thermal shutdown(2)125°C
Hysteresis(2)10°C
Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be accounted for separately.
Specified by design.
The thermal shutdown only reacts under overcurrent conditions.