SLVS782D November   2007  – October 2020 TPS2041B-Q1 , TPS2042B-Q1 , TPS2051B-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Switch
      2. 8.3.2 Charge Pump
      3. 8.3.3 Driver
      4. 8.3.4 Enable ( ENx)
      5. 8.3.5 Enable (EN)
      6. 8.3.6 Overcurrent ( OCx)
      7. 8.3.7 Current Sense
      8. 8.3.8 Thermal Sense
      9. 8.3.9 Undervoltage Lockout (UVLO)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Universal Serial Bus (USB) Applications
    2. 9.2 Typical Applications
      1. 9.2.1 TPS2042B-Q1 Typical Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Overcurrent
          2. 9.2.1.2.2 OC Response
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Hosts and Self-Powered Hubs and Bus-Powered Hubs
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 USB Power-Distribution Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Low-Power Bus-Powered and High-Power Bus-Powered Functions
      3. 9.2.3 Generic Hot-Plug Applications
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

  • Place the 100-nF bypass capacitor near the IN and GND pins and make the connections using a low-inductance trace.
  • TI recommends placing a high-value electrolytic capacitor and a 100-nF bypass capacitor on the output pin when large transient currents are expected on the output.