SLVSDH0C December   2016  – January 2018 TPS22810

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical DC Characteristics
    8. 7.8 Typical AC Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 On and Off Control
      2. 9.3.2 Quick Output Discharge (QOD)
        1. 9.3.2.1 QOD when System Power is Removed
        2. 9.3.2.2 Internal QOD Considerations
      3. 9.3.3 EN/UVLO
      4. 9.3.4 Adjustable Rise Time (CT)
      5. 9.3.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 ON and OFF Control
    3. 10.3 Input Capacitor (Optional)
    4. 10.4 Output Capacitor (Optional)
    5. 10.5 Typical Application
      1. 10.5.1 Design Requirements
      2. 10.5.2 Detailed Design Procedure
        1. 10.5.2.1 Shutdown Sequencing During Unexpected Power Loss
        2. 10.5.2.2 VIN to VOUT Voltage Drop
        3. 10.5.2.3 Inrush Current
      3. 10.5.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Developmental Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.3 Thermal Considerations

For best performance, all traces must be as short as possible. To be most effective, the input and output capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance.

The maximum IC junction temperature must be restricted to 150°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use Equation 14.

Equation 14. TPS22810 Q5_PDmax2_slvsco0.gif

where

  • PD(MAX) is the maximum allowable power dissipation
  • TJ(MAX) is the maximum allowable junction temperature (150°C for the TPS22810)
  • TA is the ambient temperature of the device
  • θJA is the junction to air thermal impedance. Refer to the Thermal Information table. This parameter is highly dependent upon board layout.