SLVSDW8B September   2017  – December 2021 TPS22917

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
      1. 7.7.1 Typical Electrical Characteristics
      2. 7.7.2 Typical Switching Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit and Timing Waveforms Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 On and Off Control
      2. 9.3.2 Turn-On Time (tON) and Adjustable Slew Rate (CT)
      3. 9.3.3 Fall Time (tFALL) and Quick Output Discharge (QOD)
        1. 9.3.3.1 QOD When System Power is Removed
    4. 9.4 Full-Time Reverse Current Blocking
    5. 9.5 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Limiting Inrush Current
        2. 10.2.2.2 Application Curves
        3. 10.2.2.3 Setting Fall Time for Shutdown Power Sequencing
        4. 10.2.2.4 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.2.1 Limiting Inrush Current

Use Equation 5 to find the maximum slew rate value to limit inrush current for a given capacitance:

Equation 5. (Slew Rate) = IRUSH ÷ CL

where

  • IINRUSH = maximum acceptable inrush current (mA)
  • CL = capacitance on VOUT (μF)
  • Slew Rate = Output Slew Rate during turn on (mV/μs)

After the required slew rate shown in Equation 1 can be used to find the minimum CT capacitance

Equation 6. CT = SRON ÷ (Slew Rate)
Equation 7. CT = 1900 ÷ 3.2 = 594 pF

To ensure an inrush current of less than 150 mA, choose a CT value greater than 594 pF. An appropriate value must be placed on such that the IMAX and IPLS specifications of the device are not violated.