SLVSDW8B September   2017  – December 2021 TPS22917

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
      1. 7.7.1 Typical Electrical Characteristics
      2. 7.7.2 Typical Switching Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit and Timing Waveforms Diagrams
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 On and Off Control
      2. 9.3.2 Turn-On Time (tON) and Adjustable Slew Rate (CT)
      3. 9.3.3 Fall Time (tFALL) and Quick Output Discharge (QOD)
        1. 9.3.3.1 QOD When System Power is Removed
    4. 9.4 Full-Time Reverse Current Blocking
    5. 9.5 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Limiting Inrush Current
        2. 10.2.2.2 Application Curves
        3. 10.2.2.3 Setting Fall Time for Shutdown Power Sequencing
        4. 10.2.2.4 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TPS22917x device is a small, single channel load switch using a low leakage P-Channel MOSFET for minimum power loss. Advanced gate control design supports operating voltages as low as 1 V with minimal increase in ON-Resistance and power loss.

The Rise and Fall times can be independently adjusted with external components for system level optimizations. The timing capacitor (CT) and turn on time can be adjusted to manage inrush current without adding unnecessary system delays. The output discharge resistance (QOD) can be used to adjust the output fall time. Connect the QOD pin directly to the output for a fastest fall time or leave it open for the slowest fall time.

The switch ON state is controlled by a digital input that can interface directly with low-voltage control signals. The TPS22917 uses active high enable logic, while the TPS22917L uses active low. When power is first applied, a Smart Pulldown is used to keep the ON pin from floating until system sequencing is complete. After the ON pin is deliberately driven high (≥VIH), the Smart Pulldown (RPD) is disconnected to prevent unnecessary power loss.

The TPS22917x device is available in a leaded SOT-23 package (DBV) which allows visual inspection of solder joints. The device is characterized for operation over a temperature range of –40°C to 125°C.

Device Information(1)
PART NUMBERPACKAGEBODY SIZE (NOM)
TPS22917xSOT-23 (6)2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-D8F5C4BC-F39A-4186-8139-4229B2C7DD87-low.gifSimplified Schematic