SLVSGK4A November   2021  – June 2022 TPS22953-Q1 , TPS22954-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3.     Recommended Operating Conditions
    4. 7.3  Thermal Information
    5. 7.4  Electrical Characteristics
    6. 7.5  Electrical Characteristics – VBIAS = 5 V
    7. 7.6  Electrical Characteristics – VBIAS = 3.3 V
    8. 7.7  Electrical Characteristics – VBIAS = 2.5 V
    9. 7.8  Switching Characteristics – CT = 1000 pF
    10. 7.9  Switching Characteristics – CT = 0 pF
    11. 7.10 Typical DC Characteristics
    12. 7.11 Typical Switching Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  On and Off Control (EN Pin)
      2. 9.3.2  Voltage Monitoring (SNS Pin)
      3. 9.3.3  Power Good (PG Pin)
      4. 9.3.4  Supervisor Fault Detection and Automatic Restart
      5. 9.3.5  Manual Restart
      6. 9.3.6  Thermal Shutdown
      7. 9.3.7  Reverse Current Blocking (TPS22953-Q1 Only)
      8. 9.3.8  Quick Output Discharge (QOD) (TPS22954-Q1 Only)
      9. 9.3.9  VIN and VBIAS Voltage Range
      10. 9.3.10 Adjustable Rise Time (CT Pin)
      11. 9.3.11 Power Sequencing
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input to Output Voltage Drop
      2. 10.1.2 Thermal Considerations
      3. 10.1.3 Automatic Power Sequencing
      4. 10.1.4 Monitoring a Downstream Voltage
      5. 10.1.5 Monitoring the Input Voltage
      6. 10.1.6 Break-Before-Make Power MUX (TPS22953-Q1 Only)
      7. 10.1.7 Make-Before-Break Power MUX (TPS22953-Q1 Only)
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inrush Current
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.6 Thermal Shutdown

If the junction temperature of the device exceeds TSD, the switch disables. The device enables after the junction temperature drops by TSDHYS as long as EN is still greater than VIH,EN.