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  • TPS22961 3.5-V, 6-A, Ultra-low Resistance Load Switch

    • SLVSCI4B February   2014  – September 2014 TPS22961

      PRODUCTION DATA.  

  • CONTENTS
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  • TPS22961 3.5-V, 6-A, Ultra-low Resistance Load Switch
  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Terminal Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics, VBIAS = 5.0 V
    6. 7.6 Electrical Characteristics, VBIAS = 3.0 V
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On/off Control
      2. 8.3.2 Input Capacitor (CIN)
      3. 8.3.3 Output Capacitor (CL)
      4. 8.3.4 VIN and VBIAS Voltage Range
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Typical Application Powering a Downstream Module
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VIN to VOUT Voltage Drop
          2. 9.2.1.2.2 Inrush Current
          3. 9.2.1.2.3 Thermal Considerations
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Typical Application Powering Rails Sensitive to Ringing and Overvoltage due to Fast Rise Time
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Picking Proper Inductor and Capacitor to Meet Voltage Overshoot Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
  14. IMPORTANT NOTICE

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNY|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information
  • slvsci4b_oa
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DATA SHEET

TPS22961 3.5-V, 6-A, Ultra-low Resistance Load Switch

1 Features

  • Integrated Single Channel Load Switch
  • VBIAS Voltage Range: 3 V to 5.5 V
  • Input Voltage Range: 0.8 V to 3.5 V
  • Ultra low RON Resistance
    • RON = 4.4 mΩ at VIN = 1.05 V (VBIAS = 5 V)
  • 6A Maximum Continuous Switch Current
  • Low Quiescent Current < 1 µA (max)
  • Low Control Input Threshold Enables use of 1.2-V/1.8-V/2.5-V/3.3-V Logic
  • Controlled Slew Rate
    • tR = 4.2 µs at VIN = 1.05 V (VBIAS = 5 V)
  • Quick Output Discharge (QOD)
  • SON 8-terminal Package with Thermal Pad
  • ESD Performance Tested per JESD 22
    • 2-kV HBM and 1-kV CDM

2 Applications

  • Ultrabook™/Notebooks
  • Desktops
  • Servers
  • Set-top Boxes
  • Telecom Systems
  • Tablet PC

3 Description

The TPS22961 is a small, ultra-low RON, single channel load switch with controlled turn on. The device contains an N-channel MOSFET that can operate over an input voltage range of 0.8 V to 3.5 V and supports a maximum continuous current of 6 A.

The combination of ultra-low RON and high current capability of the device makes it ideal for driving processor rails with very tight voltage dropout tolerances. Quick rise time of the device allows for power rails to come up quickly when the device is enabled, thereby reducing response time for power distribution. The switch can be independently controlled via the ON terminal, which is capable of interfacing directly with low-voltage control signals originating from microcontrollers or low voltage discrete logic. The device further reduces the total solution size by integrating a 260 Ω pull-down transistor for quick output discharge (QOD) when the switch is turned off.

The TPS22961 is available in a small, space-saving 3 mm x 3 mm 8-SON package (DNY) with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –40°C to 85°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE
TPS22961 WSON (8) 3.00 mm x 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

4 Simplified Schematic

typ_app_slvsci4.gif
Typical Application: driving high current core rails for a processor

RON vs VIN (VBIAS = 5 V, IOUT = –200 mA)

C007_slvsci7.png

5 Revision History

Changes from A Revision (February 2014) to B Revision

  • Fixed caption error in Filtered Output curve. Go

Changes from * Revision (February 2014) to A Revision

  • Initial release of full version. Go

6 Terminal Configuration and Functions

DNY PACKAGE
8 TERMINAL
po_slvsci4.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
VIN 1, 2 I Switch input. Place ceramic bypass capacitor(s) between this terminal and GND. See Detailed Description section for more information.
VIN Exposed thermal Pad I Switch input. Place ceramic bypass capacitor(s) between this terminal and GND. See Detailed Description section for more information.
VBIAS 3 I Bias voltage. Power supply to the device.
ON 4 I Active high switch control input. Do not leave floating.
GND 5 – Ground.
VOUT 6, 7, 8 O Switch output. Place ceramic bypass capacitor(s) between this terminal and GND. See Detailed Description section for more information.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN Input voltage range –0.3 4 V
VBIAS Bias voltage range –0.3 6 V
VOUT Output voltage range –0.3 4 V
VON ON pin voltage range –0.3 6 V
IMAX Maximum Continuous Switch Current 6 A
IPLS Maximum Pulsed Switch Current, pulse < 300 µs, 2% duty cycle 8 A
TA Operating free-air temperature range –40 85 °C
TJ Maximum junction temperature 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN MAX UNIT
TSTG Storage temperature range –65 150 °C
TLEAD Maximum lead temperature (10-s soldering time) 300 °C
VESD(1) Human-Body Model (HBM)(2) 2 kV
Charged-Device Model (CDM)(3) 1 kV
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage range 0.8 VBIAS – 1.95 V
VBIAS Bias voltage range 3 5.5 V
VON ON voltage range 0 5.5 V
VOUT Output voltage range VIN V
VIH, ON High-level voltage, ON VBIAS = 3 V to 5.5 V 1.2 5.5 V
VIL, ON Low-level voltage, ON VBIAS = 3 V to 5.5 V 0 0.5 V
CIN Input Capacitor 1(1) µF
(1) Refer to Detailed Description section.

7.4 Thermal Information

THERMAL METRIC(1) TPS22961 UNIT
DNY
8 PINS
θJA Junction-to-ambient thermal resistance 44.6 °C/W
θJCtop Junction-to-case (top) thermal resistance 44.4
θJB Junction-to-board thermal resistance 17.6
ψJT Junction-to-top characterization parameter 0.4
ψJB Junction-to-board characterization parameter 17.4
θJCbot Junction-to-case (bottom) thermal resistance 1.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics, VBIAS = 5.0 V

Unless otherwise noted, the specification in the following table applies over the operating ambient temperature
–40°C ≤ TA ≤ 85°C (full) and VBIAS = 5.0 V. Typical values are for TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IQ, VBIAS VBIAS quiescent current IOUT = 0, VIN = 3 V,
VON = VBIAS = 5.0 V		 Full 0.6 1 µA
ISD, VBIAS VBIAS shutdown current VON = 0 V, VOUT = 0 V Full 0.6 1 µA
ISD, VIN VIN shutdown current VON = 0 V,
VOUT = 0 V		 VIN = 3.0 V Full 0.0009 0.1 µA
VIN = 2.5 V 0.0008 0.1
VIN = 2.0 V 0.0007 0.1
VIN = 1.05 V 0.0007 0.1
VIN = 0.8 V 0.0006 0.1
ION ON terminal input leakage current VON = 5.5 V Full 0.1 µA
RESISTANCE CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA,
VBIAS = 5.0 V		 VIN = 3.0 V 25°C 6.5 8 mΩ
Full 8.8
VIN = 2.5 V 25°C 5.3 6.3 mΩ
Full 7.2
VIN = 2.0 V 25°C 4.8 5.8 mΩ
Full 6.7
VIN = 1.05 V 25°C 4.4 5.3 mΩ
Full 6.2
VIN = 0.8 V 25°C 4.3 5.3 mΩ
Full 6.1
RPD Output pulldown resistance VIN = 5.0 V, VON = 0 V, VOUT = 1 V Full 260 300 Ω

7.6 Electrical Characteristics, VBIAS = 3.0 V

Unless otherwise noted, the specification in the following table applies over the operating ambient temperature
–40°C ≤ TA ≤ 85°C (full) and VBIAS = 3.0 V. Typical values are for TA = 25°C unless otherwise noted.
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
POWER SUPPLIES AND CURRENTS
IQ, VBIAS VBIAS quiescent current IOUT = 0, VIN = 1 V,
VON = VBIAS = 3.0 V		 Full 0.3 1 µA
ISD, VBIAS VBIAS shutdown current VON = 0 V, VOUT = 0 V Full 0.3 1 µA
ISD, VIN VIN shutdown current VON = 0 V,
VOUT = 0 V		 VIN = 1.05 V Full 0.001 0.1 µA
VIN = 0.8 V 0.0008 0.1
ION ON terminal input leakage current VON = 5.5 V Full 0.1 µA
RESISTANCE CHARACTERISTICS
RON ON-state resistance IOUT = –200 mA,
VBIAS = 3.0 V		 VIN =1.05 V 25°C 6.7 8.4 mΩ
Full 9.2
VIN = 0.8 V 25°C 5.8 7.0 mΩ
Full 7.9
RPD Output pull-down resistance VIN = 3V, VON = 0 V, VOUT = 1 V Full 260 300 Ω

7.7 Switching Characteristics

Refer to the timing test circuit in Figure 1 (unless otherwise noted) for references to external components used for the test condition in the switching characteristics table.
PARAMETER TEST CONDITION MIN TYP MAX UNIT
VIN = 2.5 V, VON = VBIAS = 5 V, TA = 25ºC (unless otherwise noted)
tON Turn-on time RL = 10 Ω, CL = 0.1 µF 10.0 µs
tOFF Turn-off time 3.5
tR VOUT rise time 6.3
tF VOUT fall time 2.0
tD Delay time 8.1
VIN = 1.05 V, VON = VBIAS = 5 V, TA = 25ºC (unless otherwise noted)
tON Turn-on time L = 2.2 µH (DCR = 0.33 Ω),
C = 2 x 22 µF

(Refer to Typical Application Powering Rails Sensitive to Ringing and Overvoltage due to Fast Rise Time and Figure 31)		 8.1 11.3 17.3 µs
tOFF Turn-off time 13700
tR VOUT rise time 5 9.5 12.5
tF VOUT fall time 44200
tD Delay time 6.7 9.3 12.5
VIN = 0.8 V, VON = VBIAS = 5 V, TA = 25ºC (unless otherwise noted)
tON Turn-on time RL = 10 Ω, CL = 0.1 µF 9.7 µs
tOFF Turn-off time 6.0
tR VOUT rise time 3.2
tF VOUT fall time 1.8
tD Delay time 8.1
VIN = 1.05 V, VON = 5 V, VBIAS = 3.0 V, TA = 25ºC (unless otherwise noted)
tON Turn-on time RL = 10 Ω, CL = 0.1 µF 19.1 µs
tOFF Turn-off time 4.7
tR VOUT rise time 9.0
tF VOUT fall time 2.0
tD Delay time 15.6
VIN = 0.8 V, VON = 5 V, VBIAS = 3.0 V, TA = 25ºC (unless otherwise noted)
tON Turn-on time RL = 10 Ω, CL = 0.1 µF 19.0 µs
tOFF Turn-off time 5.4
tR VOUT rise time 7.0
tF VOUT fall time 1.9
tD Delay time 15.7
swtch_char_slvsci4.gifFigure 1. Switching Characteristics Measurement Setup and Definitions

7.8 Typical Characteristics

C002_slvsci7.png
VIN = 1.05 V VON = 5 V IOUT = 0 A
Figure 2. IQ,VBIAS vs VBIAS
C001_slvsci7.png
VBIAS = 5 V VON = 0 V VOUT = 0 V
Figure 4. ISD,VIN vs VIN
C005_slvsci7.png
VBIAS = 5 V VON = 5 V IOUT = –200 mA
Figure 6. RON vs Ambient Temperature
C007_slvsci7.png
VBIAS = 5 V VON = 5 V IOUT = –200 mA
Figure 8. RON vs VIN
C009_slvsci7.png
VON = 0 V VIN = 1.05 V VOUT = 1 V
Figure 10. RPD vs VBIAS
C010_slvsci7.png
VIN = VBIAS – 2 V
Figure 12. VIL,ON vs VBIAS
C015_slvsci7.png
VBIAS = 3 V RL = 10 Ω CL = 0.1 µF
Figure 14. tD vs VIN
C014_slvsci7.png
VBIAS = 3 V RL = 10 Ω CL = 0.1 µF
Figure 16. tF vs VIN
C016_slvsci7.png
VBIAS = 3 V RL = 10 Ω CL = 0.1 µF
Figure 18. tOFF vs VIN
C017_slvsci7.png
VBIAS = 3 V RL = 10 Ω CL = 0.1 µF
Figure 20. tON vs VIN
C013_slvsci7.png
VBIAS = 3 V RL = 10 Ω CL = 0.1 µF
Figure 22. tR vs VIN
C024_slvsci7.png
TA = 25°C RL = 10 Ω CL = 0.1 µF
Figure 24. tR vs VIN for Various VBIAS
C003_slvsci7.png
VON = 0 V VOUT = 0 V
Figure 3. ISD,VBIAS vs VBIAS
C004_slvsci7.png
VBIAS = 3 V VON = 5 V IOUT = –200 mA
Figure 5. RON vs Ambient Temperature
C006_slvsci7.png
VBIAS = 3 V VON = 5 V IOUT = –200 mA
Figure 7. RON vs VIN
C008_slvsci7.png
TA = 25°C VON = 5 V IOUT = –200 mA
Figure 9. RON vs VIN
C012_slvsci7.png
VBIAS = 5 V VON = 5 V IOUT = –6 A
Figure 11. RON vs VIN at 6A load
C011_slvsci7.png
VIN = VBIAS – 2 V
Figure 13. VIH,ON vs VBIAS
C020_slvsci7.png
VBIAS = 5 V RL = 10 Ω CL = 0.1 µF
Figure 15. tD vs VIN
C021_slvsci7.png
VBIAS = 5 V RL = 10 Ω CL = 0.1 µF
Figure 17. tF vs VIN
C019_slvsci7.png
VBIAS = 5 V RL = 10 Ω CL = 0.1 µF
Figure 19. tOFF vs VIN
C018_slvsci7.png
VBIAS = 5 V RL = 10 Ω CL = 0.1 µF
Figure 21. tON vs VIN
C022_slvsci7.png
VBIAS = 5 V RL = 10 Ω CL = 0.1 µF
Figure 23. tR vs VIN

 
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