SLVSCI3E April   2014  – July 2022 TPS22965-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics—VBIAS = 5 V
    6. 7.6 Electrical Characteristics—VBIAS = 2.5 V
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
      1. 7.8.1 Typical DC Characteristics
      2. 7.8.2 Typical Switching Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Adjustable Rise Time
      2. 9.3.2 Quick Output Discharge (TPS22965-Q1 and TPS22965W-Q1 Only)
      3. 9.3.3 Low Power Consumption During OFF State
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 VIN to VOUT Voltage Drop
      2. 10.1.2 On and Off Control
      3. 10.1.3 Input Capacitor (Optional)
      4. 10.1.4 Output Capacitor (Optional)
      5. 10.1.5 VIN and VBIAS Voltage Range
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inrush Current
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Consideration
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)TPS22965-Q1, TPS22965N-Q1TPS22965W-Q1, TPS22965NW-Q1UNIT
DSG0008A (WSON)DSG0008B (WSON)
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance72.367.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance96.195°C/W
RθJBJunction-to-board thermal resistance42.137.4°C/W
ψJTJunction-to-top characterization parameter3.32.9°C/W
ψJBJunction-to-board characterization parameter42.537.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance13.28°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.